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Journal Articles

Determination of Stresses in Incrementally Deposited Films From Wafer-Curvature Measurements

Zhaoxia Rao, Hanxun Jin, Alison Engwall, Eric Chason, Kyung-Suk Kim
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. October 2020, 87(10): 101006.
Paper No: JAM-20-1179
https://doi.org/10.1115/1.4047572
Published Online: July 8, 2020
View Article titled, Determination of Stresses in Incrementally Deposited Films From Wafer-Curvature Measurements
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Topics: Semiconductor wafers, Stress, Thin films, Relaxation (Physics)
Journal Articles

Evaluation of Pre-Sliding Behavior at a Rough Interface: Modeling and Experiment

M. Bazrafshan, M. B. de Rooij, E. G. de Vries, D. J. Schipper
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. April 2020, 87(4): 041006.
Paper No: JAM-19-1497
https://doi.org/10.1115/1.4045900
Published Online: January 21, 2020
View Article titled, Evaluation of Pre-Sliding Behavior at a Rough Interface: Modeling and Experiment
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Topics: Boundary element methods, Friction, Semiconductor wafers, Simulation, Stiffness, Stress, Surface roughness, Modeling, Displacement
Journal Articles

Quantitative Infrared Photoelasticity of Silicon Photovoltaic Wafers Using a Discrete Dislocation Model

T.-W. Lin, G. P. Horn, H. T. Johnson
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research-Article
J. Appl. Mech. January 2015, 82(1): 011001.
Paper No: JAM-14-1337
https://doi.org/10.1115/1.4028987
Published Online: January 1, 2015
View Article titled, Quantitative Infrared Photoelasticity of Silicon Photovoltaic Wafers Using a Discrete Dislocation Model
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Topics: Dislocations, Semiconductor wafers, Silicon, Stress
Journal Articles

A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film: Substrate Systems

Michal A. Brown, Tae-Soon Park, Ares Rosakis, Ersan Ustundag, Young Huang, Nobumichi Tamura, Bryan Valek
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Technical Papers
J. Appl. Mech. September 2006, 73(5): 723–729.
https://doi.org/10.1115/1.2150500
Published Online: October 14, 2005
View Article titled, A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film: Substrate Systems
Open the PDF for A Comparison of X-Ray Microdiffraction and Coherent Gradient Sensing in Measuring Discontinuous Curvatures in Thin Film: Substrate Systems in another window
Topics: Deformation, Semiconductor wafers, Stress, Thin films, X-ray diffraction