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Just Accepted Manuscript

Research-Article July 20, 2024
Incorporating Tensile Stress into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints
J. Electron. Packag. doi: https://doi.org/10.1115/1.4066014
Research-Article July 20, 2024
Transient Liquid Phase Bond Acceleration Using Copper Nanowires
J. Electron. Packag. doi: https://doi.org/10.1115/1.4066042
Research-Article July 20, 2024
Process Recipe and Functional Circuitry Performance On Aerosol Jet Printed Water-Based Silver Ink
J. Electron. Packag. doi: https://doi.org/10.1115/1.4066041
Research-Article July 20, 2024
Impact of Immersion Cooling On Thermomechanical Properties of Halogen-free Substrate Core
J. Electron. Packag. doi: https://doi.org/10.1115/1.4066044
Research-Article July 18, 2024
Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065988
Research-Article July 18, 2024
Electrochemical Additive Manufacturing Based Design of a Heat Sink for Single Phase Natural Convection Immersion Cooling Application
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065987
Research-Article July 17, 2024
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065944
Research-Article July 17, 2024
Convection Cooling of Power Electronics Operating in Deep-Space
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065947
Research-Article July 17, 2024
Thermal Spreading Resistance of Near Surface Localized Heating-Induced Size Effects in Semiconductors
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065945
Research-Article July 17, 2024
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065948
Review Articles July 17, 2024
Multi-Physics Coupling in IGBT Modules: A Review
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065941
Research-Article July 17, 2024
L2A Cdus Performance and Considerations for Server Rooms Upgrade with Conventional Air Conditioning
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065942
Research-Article July 17, 2024
Cold Gas Spraying Copper Metal On AlN Ceramics as an Alternative to Thick DBC Substrates for Power Electronics
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065943
Research-Article July 15, 2024
Reliability Assessment and Multi-Physics Simulation of Additively Printed Wearable Humidity Sensor with Super Capacitive Material for Astronaut in Extreme Condition
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065940
Research-Article July 15, 2024
Electrically Conductive Adhesives in Microelectronics Packaging
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065939
Research-Article July 1, 2024
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge Microdatacenter
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065863
Review Articles June 3, 2024
A Review of Mechanism and Technology of Hybrid Bonding
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065650
Research-Article March 16, 2024
Effect of Dispensing Type On Void Formation Using Convolutional Neural Network
J. Electron. Packag. doi: https://doi.org/10.1115/1.4065078
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