The performance characteristics of micro heat exchangers consisting of straight channels fabricated in a silicon wafer and operating with liquid nitrogen are evaluated theoretically. The three-dimensional conjugate temperature and flow fields are calculated numerically. The thermal resistance is computed as a function of various geometric parameters. The optimal dimensions which minimize the heat exchanger’s thermal resistance are identified. Additionally, a simple, approximate, analytical model, adequate when the ratio of the solid and liquid thermal conductivities is large, is presented and used to predict the heat exchanger’s optimal dimensions. The approximate model’s predictions are compared with the numerical results.
Issue Section:
Technical Papers
1.
Aung, W., 1991, Cooling Techniques for Computers, Hemisphere, Washington, DC.
2.
Bejan
A.
Morega
A. M.
1993
, “Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 115
, pp. 75
–81
.3.
Bergles
A. E.
1986
, “The Evolution of Cooling Technology for Electrical, Electronic, and Microelectronic Equipment
,” Heat Transfer in Electronic Equipment
, ASME, HTD-57
, pp. 1
–9
.4.
Bergles, A. E., 1990, “Heat Transfer in Electronic and Microelectronic Equipment,” Proceedings of the International Center for Heat and Mass Transfer, Vol. 29, Hemisphere, Washington, DC.
5.
Keyes
R.
1984
, “Heat Transfer in Forced Convection Through Fins
,” IEEE Transaction on Electron Devices
, Vol. ED-31
, 1218
–1221
.6.
Patankar, S. V., 1980, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing Corporation, McGraw-Hill, New York.
7.
Phillips, R., 1987, “Forced-convection, Liquid-cooled, Microchannel Heat Sinks,” Master thesis, MIT, Cambridge, MA.
8.
Phillips
R.
1990
, “Microchannel Heat Sinks
,” Advances in Thermal Modeling of Electronic Components and Systems
, A. Bar Cohen and A. D. Kraus, eds., Vol. 2
, pp. 109
–184
.9.
Riddle, R. A., 1993, “Thermal Stresses in the Microchannel Heatsink Cooled by Liquid Nitrogen,” Lawrence Livermore National Laboratory, Paper No. UCRL-JC-114422.
10.
Riddle, R. A., and Bernhardt, A. F., 1992, “The Microchannel Heat Sink with Liquid Nitrogen Cooling,” Lawrence Livermore National Laboratory, Paper No. UCRL-JR-109267.
11.
Riddle, R. A., and Bernhardt, A. F., 1993, “The Onset of Nucleate and Fully Developed Boiling in Microchannel Heatsinks With Liquid Nitrogen Cooling,” Lawrence Livermore National Laboratory, Paper No. UCRL-JC-114405.
12.
Riddle, R. A., Contolini, R. J., and Bernhardt, A. F., 1991, “Design Calculations for the Microchannel Heat Sink,” Lawrence Livermore National Laboratory, Paper No. UCRL-JC-105120.
13.
Samalam
V. K.
1989
, “Convective Heat Transfer in Microchannels
,” J. Electronic Materials
, Vol. 18
, pp. 611
–617
.14.
Sasaki
S.
Kishimoto
T.
1986
, “Optimal Structure for Microgrooved Cooling Fin for High-Power LSI Devices
,” Electronics Letters
, Vol. 22
, pp. 1332
–1333
.15.
Shah, R. K., and London, A. L., 1978, Laminar Flow Forced Convection in Ducts, Academic Press, New York.
16.
Tuckerman, D., 1984, “Heat Transfer Microstructures for Integrated Circuits,” Ph.D. thesis, Stanford University, Stanford, CA.
17.
Tuckerman
D. B.
Pease
R.
1981
, “High-Performance Heat Sinking for VLSI
,” IEEE Electron Device Letters
, EDL-2
(5
), pp. 126
–129
.18.
Yin, X., 1995, “Micro Heat Exchangers,” Ph.D. dissertation, Univ. of Pennsylvania, Philadelphia, PA.
19.
Yin
X.
Bau
H. H.
1996
, “The Conjugate Graetz Problem with Axial Conduction
,” ASME JOURNAL OF HEAT TRANSFER
, Vol. 118
, pp. 482
–484
.20.
Weisberg
A.
Bau
H. H.
Zemel
J.
1992
, “Analysis of Microchannels for Integrated Cooling
,” Int. J. Heat Mass Transfer
, Vol. 35
, pp. 2465
–2474
.21.
White, F. M., 1974, Viscous Fluid Flow, 123, McGraw-Hill, New York.
22.
Wolfram, S., 1991, Mathematica, Addison Wesley,
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