The reliability of solder joints in electronic packaging is becoming more important as the ball grid array (BGA) develops rapidly into the most popular packaging technology. Thermal fatigue of solder joints has been a reliability concern in the electronic packaging industry since the introduction of surface mount technology (SMT). Microstructural coarsening (phase growth) is considered to be closely related to thermomechanical fatigue failure. Many researchers proposed coarsening models for bulk scale metals. But these models have never been verified for micron-scale actual BGA solder balls. In the present study, three different phase growth models are investigated experimentally on BGA solder balls in a real-life electronic package. Model simulations obtained from three models were compared against test data. The best performing model was chosen for finite element fatigue reliability studies based on continuum damage mechanics.
Issue Section:
Technical Papers
1.
Solomon
, H. D.
, 1986
, Brazing and Soldering
,11
, pp. 68
–75
.2.
Solomon
, H. D.
, and Tolksdorf
, E. D.
, 1995
, J. Electron. Packag.
, 117
, pp. 130
–135
.3.
Dasgupta
, A.
, and Hu
, J. M.
, 1992
, IEEE Trans. Reliab.
, 41
, pp. 489
–495
.4.
Wei
, Y.
, and Chow
, C. L.
, 2001
, Int. J. Damage Mech.
, 10
, pp. 133
–152
.5.
Guo
, Q.
, Cutiongco
, E. C.
, Keer
, L. M.
, and Fine
, M. E.
, 1992
, J. Electron. Packag.
, 114
, pp. 145
–151
.6.
Busso
, E. P.
, Kitano
, M.
, and Kumazawa
, T.
, 1994
, J. Electron. Packag.
, 116
, pp. 6
–15
.7.
Lau, J. H., and Pao, Y. H., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York.
8.
McDowell
, D. L.
, Miller
, M. P.
, and Brooks
, D. C.
, 1994
, “Fatigue of Electronic Materials
,” ASTM Spec. Tech. Publ.
, 1153
, pp. 42
–59
.9.
Basaran
, C.
, and Chandaroy
, R.
, 1997
, IEEE Trans. Compon., Packag. Manuf. Technol., Part A
, 20
, pp. 530
–536
.10.
Basaran
, C.
, and Chandaroy
, R.
, 1998
, J. Appl. Math. Modeling
,22
, pp. 601
–627
.11.
Basaran
, C.
, and Chandaroy
, R.
, 1999
, ASME J. Electron. Packag.
, 121
, pp. 8
–12
.12.
Basaran
, C.
, and Chandaroy
, R.
, 1999
, ASME J. Electron. Packag.
, 121
, pp. 12
–17
.13.
Basaran
, C.
, and Yan
, C. Y.
, 1998
, ASME J. Electron. Packag.
, 120
, pp. 379
–384
.14.
Basaran
, C.
, Desai
, C. S.
, and Kundu
, T.
, 1998
, ASME J. Electron. Packag.
, 120
, pp. 41
–47
.15.
Chandaroy
, R.
, and Basaran
, C.
, 1999
, ASME J. Electron. Packag.
, 121
, pp. 61
–68
.16.
Basaran
, C.
, and Tang
, H.
, 2001
, “Influence of Microstruture Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints
,” Int. J. Damage Mech.
10
(3
), pp 235
–255
.17.
Basaran
, C.
, Tang
, H.
, Dishongh
, T.
, and Searls
, D.
, 2001
, Advanced Packaging
,1
, pp. 17
–22
.18.
Basaran
, C.
, Cartwright
, A.
, and Zhao
, Y.
, 2001
, Int. J. Damage Mech.
, 10
, pp. 153
–170
.19.
Morris, Jr., J. W., Tribula, D., Summers, T. S. E., and Grivas D., 1991, “The Role of Microstructure in Thermal Fatigue of Pb/Sn Solder Joints,” in Solder Joint Reliability, J. H. Lau et al., eds., Van Nostrand Reinhold, New York, pp. 225–265.
20.
Frear
, D. R.
, Burchett
, S. N.
, and Neilsen
, M. K.
, 1997
, Adv. Electron. Packag.
, E. Suhir et al., EEP-19-2
, pp. 1515
–1522
.21.
Li
, L.
, and Muller
, W. H.
, 2001
, Comput. Mater. Sci.
, 21
, pp. 159
–184
.22.
Bangs
, E. R.
, and Beal
, R. E.
, 1978
, Wel. J. Res. Supp.
,54
, p. 377
377
.23.
Frear
, D. R.
, and Morris
, D.
, 1988
, J. Met.
, 40
, pp. 18
–22
.24.
Wolverton
, A.
, 1987
, Brazing and Soldering
,13
, p. 33
33
.25.
Tribula
, D. G.
, Grivas
, D.
, Frear
, D.
, and Morris
, J.
, 1989
, J. Electron. Packag.
, 111
, pp. 83
–89
.26.
Kashyap
, B. P.
, and Murty
, G. S.
, 1982
, Metall. Trans. A
, 13
, pp. 53
–59
.27.
Zhao
, Y.
, Basaran
, C.
, Cartwright
, A.
, and Dishongh
, T.
, 1999
, J. Mech. Behav. Mater.
, 10
, pp. 135
–146
.28.
Zhao
, Y.
, Basaran
, C.
, Cartwright
, A.
, and Dishongh
, T.
, 2000
, Mech. Mater.
, 32
, pp. 161
–173
.29.
Callister, Jr., W., 1985, Materials Science and Enginering: An Introduction, Wiley, New York.
30.
Speight
, M. V.
, 1968
, Acta Metall.
, 16
, pp. 133
–135
.31.
Ardell
, A. J.
, 1972
, Acta Metall.
, 20
, pp. 61
–71
.32.
Ardell
, A. J.
, 1972
, Acta Metall.
, 20
, pp. 601
–609
.33.
Senkov
, O. N.
, and Myshlyaev
, M. M.
, 1986
, Acta Metall.
, 34
, pp. 97
–106
.34.
Sayama
, T.
, Takayanagi
, T.
, and Mori
, T.
, 1999, Advances in Electronic Packaging, EEP- 26-1.35.
Clark
, M. A.
, and Alden
, T. H.
, 1973
, Acta Metall.
, 21
, p. 1195
1195
.36.
Lifshitz
, I. M.
, and Slyozov
, V. V.
, 1961
, J. Phys. Chem. Solids
, 19
, p. 35
35
.37.
Hillert
, M.
, 1965
, Acta Metall.
, 13
, pp. 227
–238
.38.
Martin, J. W., and Doherty, R. D., 1976, Stability of Microstructure in Metallic Systems, Cambridge University Press, Cambridge, U.K.
39.
Hacke
, P. L.
, Sprecher
, A. F.
, and Conrad
, H.
, 1993
, ASME J. Electron. Packag.
, 115
, pp. 153
–164
.40.
Arrowood, R., Mukherjee, A., and Jones, W., 1991, “Hot Deformation of Two-Phase Mixtures,” Chap. 3 in Solder Mechanics: A State of the Art Assessment, Frear, D., Jones, W. B., and Kinsman, K. (eds.), TMS, Minerals, Metals & Materials Society, Warrendale, PA.
41.
Nabarro
, F. R. N.
, 1998
, Scr. Mater.
, 39
, pp. 1681
–1683
.42.
Upadhyayula, K. S., 1999, “An Incremental Damage Superposition Approach for Surface Mount Electronic Interconnect Durability Under Combined Temperature and Vibration Environments,” Ph.D. dissertation, University of Maryland, 1999.
43.
Bonda
, N. R.
, and Noyan
, I. C.
, 1996
, IEEE Trans. Compon., Packag. Manuf. Technol., Part A
, 19
, pp. 208
–212
.Copyright © 2003
by ASME
You do not currently have access to this content.
