Fracture mechanics approaches have been used to study reliability problems in electronic packages, in particular, adhesion related failure in flip chip assembly. It was verified in this work that the J-integral with a special flat rectangular contour near the crack tip can be used as energy release rate at the interface between chip and underfill. Meanwhile, the delamination propagation rates at the interface was measured by using C-mode scanning acoustic microscope (C-SAM) inspection for two types of flip chip packages under thermal cycle loading. Finally, the half-empirical Paris equation, which can be used as a design base of delamination reliability in flip chip package, has been determined from the crack propagation rates measured and the energy release rates simulated.
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e-mail: blxu@infooffice.sta.net.cn
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March 2004
Technical Papers
Research of Underfill Delamination in Flip Chip by the J-Integral Method
Bulu Xu,
e-mail: blxu@infooffice.sta.net.cn
Bulu Xu
DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, Shanghai 200050
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Xia Cai,
Xia Cai
DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, Shanghai 200050
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Weidong Huang,
Weidong Huang
DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, Shanghai 200050
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Zhaonian Cheng
Zhaonian Cheng
DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, Shanghai 200050
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Bulu Xu
DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, Shanghai 200050
e-mail: blxu@infooffice.sta.net.cn
Xia Cai
DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, Shanghai 200050
Weidong Huang
DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, Shanghai 200050
Zhaonian Cheng
DaimlerChrysler SIM Lab, Shanghai Institute of Microsystem & Information Technology, Chinese Academy of Sciences, Shanghai 200050
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Oct. 2003. Associate Editor: Z. Suo.
J. Electron. Packag. Mar 2004, 126(1): 94-99 (6 pages)
Published Online: April 30, 2004
Article history
Received:
October 1, 2003
Online:
April 30, 2004
Citation
Xu, B., Cai , X., Huang , W., and Cheng, Z. (April 30, 2004). "Research of Underfill Delamination in Flip Chip by the J-Integral Method ." ASME. J. Electron. Packag. March 2004; 126(1): 94–99. https://doi.org/10.1115/1.1648061
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