An important design objective that is unique to hand-held units is the need to constrain two temperatures: the maximum temperature of the electronic components and the maximum skin temperature of the hand-held unit. The present work identifies and evaluates, through parametric modeling and experiments, the passive thermal energy storage volume characteristics and phase change material composite properties that are most suitable for thermal control of small form-factor, high power-density, hand-held electronics. A one-dimensional transient analytical model, based on an integral heat balance, is formulated and benchmarked. The model accurately simulates the heat storage/recovery process in a semi-infinite, “dry” phase change material slab. Dimensional analysis identifies the time and temperature metrics and nondimensional parameters that describe the heat storage/release process. Parametric analysis illustrates how changes in these nondimensional parameters affect thermal energy storage volume thermal response.
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March 2012
Research Papers
Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics
K. Swanson,
K. Swanson
Mechanical Engineering Department,
University of Nevada
, Reno, NV 89557
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M. Yaquinto
M. Yaquinto
Mechanical Engineering Department,
University of Nevada
, Reno, NV 89557
Search for other works by this author on:
R. A. Wirtz
K. Swanson
Mechanical Engineering Department,
University of Nevada
, Reno, NV 89557
M. Yaquinto
Mechanical Engineering Department,
University of Nevada
, Reno, NV 89557J. Electron. Packag. Mar 2012, 134(1): 011002 (8 pages)
Published Online: March 19, 2012
Article history
Received:
August 10, 2010
Revised:
November 3, 2011
Accepted:
November 30, 2011
Published:
March 7, 2012
Online:
March 19, 2012
Citation
Wirtz, R. A., Swanson, K., and Yaquinto, M. (March 19, 2012). "Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics." ASME. J. Electron. Packag. March 2012; 134(1): 011002. https://doi.org/10.1115/1.4005915
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