Topics: Crack propagation , Solder joints , Failure , Creep , Cycles , Finite element analysis , Fracture (Materials) , Solders , Computer software , Cracking (Materials)

Experimental Analysis of Thermal Cycling Fatigue of Four-Layered FR4 Printed Wiring Boards

Tsung-Yu Pan, Ronald R. Cooper, Howard D. Blair, Thomas J. Whalen, John M. Nicholson

J. Electron. Packag. June 1994, 116(2): 76–82. doi: https://doi.org/10.1115/1.2905508

Abstract

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Topics: Experimental analysis , Fatigue , Printed circuit boards , Cycles , Design , Electrical resistance , Fracture (Materials) , Chain , Cracking (Materials) , Electronic packages

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

R. K. Govila, E. Jih, Y.-H. Pao, C. Larner

J. Electron. Packag. June 1994, 116(2): 83–88. doi: https://doi.org/10.1115/1.2905509

Abstract

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Topics: Fatigue damage , Resistors , Solder joints , Solders , Damage , Stress concentration , Corners (Structural elements) , Cracking (Materials) , Cycles , Design

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

M. K. Schwiebert

J. Electron. Packag. June 1994, 116(2): 89–91. doi: https://doi.org/10.1115/1.2905510

Abstract

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Topics: Solder joints , Stability , Surface mount packaging , Solders , Rocks , Surface mount technology

Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment

D. B. Barker, Sidharth

J. Electron. Packag. June 1994, 116(2): 92–97. doi: https://doi.org/10.1115/1.2905511

Abstract

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Topics: Manufacturing , Printed circuit boards , Cross section (Physics) , Electronic components , Rotation , Stiffness , Stress

A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals

Barry Mathieu, Abhijit Dasgupta

J. Electron. Packag. June 1994, 116(2): 98–104. doi: https://doi.org/10.1115/1.2905512

Abstract

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Topics: Glass , Metals , Stress analysis (Engineering) , Stress , Design , Experimental design , Fracture (Materials) , Fracture (Process) , Geometry , Simulation

The Effects of Adhesive Nonlinearity on Thermal Stress in Layered Components

Wan-Lee Yin, James L. Dale

J. Electron. Packag. June 1994, 116(2): 105–109. doi: https://doi.org/10.1115/1.2905497

Abstract

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Topics: Adhesives , Thermal stresses , Stress , Bonding , Materials properties , Stress-strain relations , Variational techniques

Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions

H. D. Conway, P. Bo̸rgesen, C.-Y. Li

J. Electron. Packag. June 1994, 116(2): 110–115. doi: https://doi.org/10.1115/1.2905498

Abstract

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Topics: Elastic analysis , Flip-chip , Solder joints , Stress , Deformation , Thermodynamic power cycles

Immersion-Cooled Standard Electronic Clamshell Module: A Building Block for Future High-Flux Avionic Systems

Issam Mudawar, Peter E. Jimenez, Robert E. Morgan

J. Electron. Packag. June 1994, 116(2): 116–125. doi: https://doi.org/10.1115/1.2905499

Abstract

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Topics: Aluminum , Blocks (Building materials) , Boiling , Cavities , Condensed matter , Coolants , Cooling , Energy dissipation , Flow (Dynamics) , Hardware

Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

C. Beckermann, T. F. Smith, B. Pospichal

J. Electron. Packag. June 1994, 116(2): 126–133. doi: https://doi.org/10.1115/1.2905500

Abstract

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Topics: Simulation models , Thermal analysis , Heat transfer , Radiation (Physics) , Air flow , Convection , Drag (Fluid dynamics) , Geometry , Heat conduction , Heat losses

Thermal Model of a PC

Ronald L. Linton, D. Agonafer

J. Electron. Packag. June 1994, 116(2): 134–137. doi: https://doi.org/10.1115/1.2905501

Abstract

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Topics: Air flow , Computers , Convection , Cooling , Electronic packages , Flow (Dynamics) , Geometry , Modeling , Simulation , Temperature

Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid

Y. Joshi, M. D. Kelleher, M. Powell, E. I. Torres

J. Electron. Packag. June 1994, 116(2): 138–147. doi: https://doi.org/10.1115/1.2905502

Abstract

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Topics: Dielectric liquids , Heat transfer , Natural convection , Temperature , Boundary-value problems , Cooling , Electronic packages , Energy dissipation , Heat exchangers , Plates (structures)

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht

J. Electron. Packag. June 1994, 116(2): 148–153. doi: https://doi.org/10.1115/1.2905503

Abstract

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Topics: Ceramics , Low temperature , Thermomechanics , Temperature , Bending strength , Design , Elastic moduli , Electronic packages , Fracture toughness , Materials properties

Technical Briefs

Bending and Twisting of 60Sn40Pb Solder Interconnects With Creep

John H. Lau

J. Electron. Packag. June 1994, 116(2): 154–157. doi: https://doi.org/10.1115/1.2905504

Abstract

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Topics: Creep , Solders , Cylinders , Geometry , Materials properties

Influence of Surface Mount Lead End Geometry on Fatigue Life

Vineet K. Gupta, Donald B. Barker

J. Electron. Packag. June 1994, 116(2): 157–160. doi: https://doi.org/10.1115/1.2905505

Abstract

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Topics: Fatigue life , Geometry , Surface mount packaging , Shapes , Solder joints , Solders , Dimensions , Fatigue , Fatigue damage , Finite element analysis