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Issues
September 1999
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions
J. Electron. Packag. September 1999, 121(3): 137–142.
doi: https://doi.org/10.1115/1.2792675
Topics:
Steady state
,
Transfer molding
,
Wire
,
Cavities
,
Density
,
Failure
,
Fluid dynamics
,
Transparency
,
Vehicles
,
Vents
Minimization of Heat Sink Mass Using CFD and Mathematical Optimization
J. Electron. Packag. September 1999, 121(3): 143–147.
doi: https://doi.org/10.1115/1.2792676
Topics:
Computational fluid dynamics
,
Heat sinks
,
Optimization
,
Design
,
Heat
,
Air flow
,
Cooling
,
Heat transfer
,
Temperature
Hygrothermal Fracture Analysis of Plastic IC Package in Reflow Soldering Process
J. Electron. Packag. September 1999, 121(3): 148–155.
doi: https://doi.org/10.1115/1.2792677
A Heat Sink Performance Study Considering Material, Geometry, Nozzle Placement, and Reynolds Number With Air Impingement
J. Electron. Packag. September 1999, 121(3): 156–161.
doi: https://doi.org/10.1115/1.2792678
Topics:
Geometry
,
Heat sinks
,
Nozzles
,
Reynolds number
,
Heat transfer
,
Air flow
,
Aluminum
,
Carbon composites
A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys
J. Electron. Packag. September 1999, 121(3): 162–168.
doi: https://doi.org/10.1115/1.2792679
Topics:
Alloys
,
Damage
,
Fatigue
,
Solders
,
Viscoplasticity
,
Constitutive equations
,
Creep
,
Damage mechanics
,
Deformation
,
Elasticity
Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes
J. Electron. Packag. September 1999, 121(3): 169–178.
doi: https://doi.org/10.1115/1.2792680
Topics:
Printing
,
Solders
,
Electronic packaging
,
Adhesives
,
Analytical methods
,
Ball-Grid-Array packaging
,
Flip-chip
,
Flip-chip devices
,
Imaging
,
Measurement systems
Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy
J. Electron. Packag. September 1999, 121(3): 179–185.
doi: https://doi.org/10.1115/1.2792681
Topics:
Alloys
,
Mechanical properties
,
Solders
,
Temperature
,
Testing
J-Lead Solder Joint Thermal Fatigue Life Model
J. Electron. Packag. September 1999, 121(3): 186–190.
doi: https://doi.org/10.1115/1.2792682
Topics:
Fatigue life
,
Solder joints
,
Cycles
,
Finite element analysis
,
NASA
,
Damage
,
Failure
,
Fracture (Materials)
,
Probability
,
Computers
Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw
J. Electron. Packag. September 1999, 121(3): 191–195.
doi: https://doi.org/10.1115/1.2792683
Topics:
Abrasive machining
,
Semiconductor wafers
,
Stress
,
Abrasives
,
Manufacturing
,
Pressure
,
Shear stress
,
Slurries
,
Wire
,
Cutting
Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages
J. Electron. Packag. September 1999, 121(3): 196–201.
doi: https://doi.org/10.1115/1.2792684
Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks
J. Electron. Packag. September 1999, 121(3): 202–208.
doi: https://doi.org/10.1115/1.2792685
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