Topics: Cables , Contact resistance , Finite element model , Heating , Surface roughness , Temperature , Joules , Current density , Stress , Flow (Dynamics)

Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics

R. A. Wirtz, K. Swanson, M. Yaquinto

J. Electron. Packag. March 2012, 134(1): 011002. doi: https://doi.org/10.1115/1.4005915

Abstract

View articletitled, Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics

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Topics: Electronics , Heat , Phase transitions , Power density , Skin , Temperature , Thermal energy storage , Transients (Dynamics) , Thermal management , Cooling

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

C. Y. Khor, M. Z. Abdullah, M. Abdul Mujeebu

J. Electron. Packag. March 2012, 134(1): 011003. doi: https://doi.org/10.1115/1.4005914

Abstract

View articletitled, Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

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Topics: Flip-chip , Flip-chip devices , Flow (Dynamics) , Non-Newtonian flow , Plates (structures) , Fluids , Simulation , Computational fluid dynamics , Finite volume methods , Pressure drop

Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens

R. Antón, A. Bengoechea, A. Rivas, J. C. Ramos, G. S. Larraona

J. Electron. Packag. March 2012, 134(1): 011004. doi: https://doi.org/10.1115/1.4005913

Abstract

View articletitled, Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens

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Topics: Fans , Flow (Dynamics) , Porosity , Pressure , Electromagnetic compatibility , Air flow

Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

Yasutada Nakagawa, Ryohei Yokoyama

J. Electron. Packag. March 2012, 134(1): 011005. doi: https://doi.org/10.1115/1.4005954

Abstract

View articletitled, Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

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Topics: Hardening (Curing) , Heating , Optimization , Temperature , Viscosity , Anisotropy

Comparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data Center

Qifei Jian, Qiaoli Wang, Haoting Wang, Zheng Zuo

J. Electron. Packag. March 2012, 134(1): 011006. doi: https://doi.org/10.1115/1.4005912

Abstract

View articletitled, Comparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data Center

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Topics: Air flow , Data centers , Diffusers , Temperature , Computational fluid dynamics , Computer simulation

An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

Sushma Madduri, William Infantolino, Bahgat.G Sammakia

J. Electron. Packag. March 2012, 134(1): 011007. doi: https://doi.org/10.1115/1.4005911

Abstract

View articletitled, An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

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Topics: Epoxy adhesives , Epoxy resins , Temperature , Temperature effects , Stress analysis (Engineering)

Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris

J. Electron. Packag. March 2012, 134(1): 011008. doi: https://doi.org/10.1115/1.4005910

Abstract

View articletitled, Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

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Topics: Condensation , Lasers , Temperature , Cycles

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Banafsheh Barabadi, Yogendra K. Joshi, Satish Kumar, Gamal Refai-Ahmed

J. Electron. Packag. March 2012, 134(1): 011009. doi: https://doi.org/10.1115/1.4006137

Abstract

View articletitled, Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

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Topics: Heat , Heating , Joules , Temperature , Transients (Dynamics) , Transmission lines , Steady state , Resistors , Currents , Simulation

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

P. Borgesen, D. Blass, M. Meilunas

J. Electron. Packag. March 2012, 134(1): 011010. doi: https://doi.org/10.1115/1.4005904

Abstract

View articletitled, Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

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Topics: Ball-Grid-Array packaging , Bonding , Corners (Structural elements) , Fracture (Materials) , Solder joints , Solders , Cycles , Manufacturing , Cracking (Materials) , Fracture (Process)

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Hung-Jen Chang, Chau-Jie Zhan, Tao-Chih Chang, Jung-Hua Chou

J. Electron. Packag. March 2012, 134(1): 011011. doi: https://doi.org/10.1115/1.4005956

Abstract

View articletitled, Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

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Topics: Failure , Failure analysis , Fracture (Materials) , Intermetallic compounds , Lead-free solders , Printed circuit board assemblies , Solder joints , Solders , Stress , Tin

Technical Briefs

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

Zhi Huang, Xinsheng Zhang, Ming Zhou, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu

J. Electron. Packag. March 2012, 134(1): 014501. doi: https://doi.org/10.1115/1.4005908

Abstract

View articletitled, Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

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Topics: Biomimetics , Cooling , Energy dissipation , Heat , Microelectronic devices , Skin , Temperature , Natural convection

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Thermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens

Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

Comparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data Center

An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method

Effects of Corner/Edge Bonding and Underfill Properties on the Thermal Cycling Performance of Lead Free Ball Grid Array Assemblies

Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test

Technical Briefs

Bio-inspired Passive Skin Cooling for Handheld Microelectronics Devices

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