Volume 145 Issue 1 | J. Electron. Packag.

Skip Nav Destination

Special Section: InterPACK2021

GUEST EDITORIAL

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

J. Electron. Packag. March 2023, 145(1): 010301. doi: https://doi.org/10.1115/1.4056558

Extract

View articletitled, Special Section on InterPACK2021

Open the PDF for in another window

Topics: Additive manufacturing , Artificial intelligence , Data centers , Electronic packaging , Electronics , Engineering teachers , Integrated circuit packaging , Integrated circuits , Microelectromechanical systems , Microelectronic devices

SPECIAL PAPERS

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink

J. Electron. Packag. March 2023, 145(1): 011101. doi: https://doi.org/10.1115/1.4055464

Abstract

View articletitled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Open the PDF for in another window

Topics: Aircraft , Cooling , Cooling systems , Flight , Heat exchangers , Stress , Temperature , Thermal management , Transients (Dynamics) , Motors

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

J. Electron. Packag. March 2023, 145(1): 011102. doi: https://doi.org/10.1115/1.4055394

Abstract

View articletitled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Open the PDF for in another window

Topics: Anodes , Creep , Current density , Electrodiffusion , Solder joints , Stress , Temperature

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

J. C. C. Lo, Q. Jiang, X. Qiu, N. Tu

J. Electron. Packag. March 2023, 145(1): 011103. doi: https://doi.org/10.1115/1.4055840

Abstract

View articletitled, Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

Open the PDF for in another window

Topics: High temperature , Inks , Reliability , Shear (Mechanics) , Sintering , Storage , Solders , Additive manufacturing , Solder joints

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani

J. Electron. Packag. March 2023, 145(1): 011104. doi: https://doi.org/10.1115/1.4055841

Abstract

View articletitled, Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Open the PDF for in another window

Topics: Boiling , Critical heat flux , Heat flux , Heat transfer , Nanofluids , Water , Thermal resistance , Aluminum , Wall temperature , Temperature

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic

J. Electron. Packag. March 2023, 145(1): 011105. doi: https://doi.org/10.1115/1.4056031

Abstract

View articletitled, HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Open the PDF for in another window

Topics: Coolants , Electrodes , Flow (Dynamics) , Fluids , Temperature , Cooling

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao

J. Electron. Packag. March 2023, 145(1): 011106. doi: https://doi.org/10.1115/1.4056030

Abstract

View articletitled, Module-Level Thermal Interface Material Degradation in HALT

Supplementary data

Open the PDF for in another window

Topics: Cycles , Life testing , Stress , Temperature , Testing , Thermal resistance , Vibration , Electronics , Reliability , Heating

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler

J. Electron. Packag. March 2023, 145(1): 011107. doi: https://doi.org/10.1115/1.4056445

Abstract

View articletitled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Open the PDF for in another window

Topics: Design , Reliability , Simulation , Thermomechanics , Manufacturing , Solders , Computer simulation , Creep , Stress , Cycles

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

Pradeep Lall, Hyesoo Jang

J. Electron. Packag. March 2023, 145(1): 011108. doi: https://doi.org/10.1115/1.4056412

Abstract

View articletitled, Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

Open the PDF for in another window

Topics: Batteries , Cycles , Lithium-ion batteries , Machine learning , Regression models , Reliability , Stress

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller

J. Electron. Packag. March 2023, 145(1): 011109. doi: https://doi.org/10.1115/1.4056477

Abstract

View articletitled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Open the PDF for in another window

Topics: Adhesives , Electronics , Reliability , Surface preparation , Temperature , Stress , Inks , Silver

RESEARCH PAPERS

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger

J. Electron. Packag. March 2023, 145(1): 011201. doi: https://doi.org/10.1115/1.4054651

Abstract

View articletitled, Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Open the PDF for in another window

Topics: Heat , Phase change materials , Steady state , Temperature , Transients (Dynamics) , Melting , Copper , Heat sinks , Tradeoffs , Simulation

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian

J. Electron. Packag. March 2023, 145(1): 011202. doi: https://doi.org/10.1115/1.4054462

Abstract

View articletitled, Electrothermal Analysis of System in Package for Aerospace Application

Open the PDF for in another window

Topics: Aerospace industry , Design , Heat , Joules , Reliability , Simulation , System-in-package , Temperature , Vacuum , Errors

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao

J. Electron. Packag. March 2023, 145(1): 011203. doi: https://doi.org/10.1115/1.4054698

Abstract

View articletitled, Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Open the PDF for in another window

Topics: Diffusion (Physics) , Gallium nitride , Heat , Heating , Modeling , Phonons , Simulation , Temperature , Heat conduction , Junctions

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2023, 145(1): 011204. doi: https://doi.org/10.1115/1.4054784

Abstract

View articletitled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Open the PDF for in another window

Topics: Glass transition , Reliability , Semiconductor wafers , Storage , Stress , Temperature , Testing , Viscoelasticity , Solders , Failure

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen

J. Electron. Packag. March 2023, 145(1): 011205. doi: https://doi.org/10.1115/1.4054821

Abstract

View articletitled, The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Open the PDF for in another window

Topics: Algebra , Deformation , Differential equations , Genetic algorithms , Stress , Errors , Solders

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

T.-C. Huang, K.-C. Liao

J. Electron. Packag. March 2023, 145(1): 011206. doi: https://doi.org/10.1115/1.4054822

Abstract

View articletitled, Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

Open the PDF for in another window

Topics: Shock (Mechanics) , Contact resistance , Displacement

Special Section: InterPACK2021

GUEST EDITORIAL

Special Section on InterPACK2021

SPECIAL PAPERS

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Module-Level Thermal Interface Material Degradation in HALT

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

RESEARCH PAPERS

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Electrothermal Analysis of System in Package for Aerospace Application

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Issues

Special Section: InterPACK2021

GUEST EDITORIAL

SPECIAL PAPERS

RESEARCH PAPERS

Email alerts

RSS Feeds

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only