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2D heterogeneous integration of ASIC, EIC, and PIC: ( a ) on an ordinary co...
Published Online: June 20, 2024
Fig. 10 2D heterogeneous integration of ASIC, EIC, and PIC: ( a ) on an ordinary co-packaged substrate, ( b ) on TSV-interposer or organic-interposer, and ( c ) on TSV-interposer or organic-interposer and then on package substrate More about this image found in 2D heterogeneous integration of ASIC, EIC, and PIC: ( a ) on an ordinary co...
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2D heterogeneous integration of ASIC, EIC, and PIC with silicon bridges on ...
Published Online: June 20, 2024
Fig. 13 2D heterogeneous integration of ASIC, EIC, and PIC with silicon bridges on a co-packaged substrate: ( a ) bridge with μ bumps, ( b ) bridge with hybrid bonding, and ( c ) EMIB More about this image found in 2D heterogeneous integration of ASIC, EIC, and PIC with silicon bridges on ...
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3D heterogeneous integration of ASIC, EIC, and PIC: ( a ) on an ordinary co...
Published Online: June 20, 2024
Fig. 15 3D heterogeneous integration of ASIC, EIC, and PIC: ( a ) on an ordinary co-packaged substrate, ( b ) on TSV-interposer or organic-interposer, and ( c ) on TSV-interposer or organic-interposer and then on package substrate More about this image found in 3D heterogeneous integration of ASIC, EIC, and PIC: ( a ) on an ordinary co...
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