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Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
View Article titled, Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis
Journal Articles

Simplified Thermal Model of a Stacked Ball Grid Array Package

Luigi P. M. Colombo, Alexey Petrushin, Davide Paleari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021006.
https://doi.org/10.1115/1.4003991
Published Online: June 23, 2011
View Article titled, Simplified Thermal Model of a Stacked Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Solders, Temperature, Thermal resistance, Ball-Grid-Array packaging, Heat, Errors, Boundary-value problems, Junctions
Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
https://doi.org/10.1115/1.4002741
Published Online: December 8, 2010
View Article titled, Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package
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Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus
Journal Articles

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Xi Liu, Jiantao Zheng, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
https://doi.org/10.1115/1.4001746
Published Online: June 11, 2010
View Article titled, Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
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Topics: Finite element analysis, Manufacturing, Model validation, Reliability, Temperature, Warping, Laminates, Weight (Mass), Lasers, Thermomechanics
Journal Articles

Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package

Hu Guojun, Andrew A. O. Tay, Luan Jing-En, Ma Yiyi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
https://doi.org/10.1115/1.4001145
Published Online: March 19, 2010
View Article titled, Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package
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Topics: Ball-Grid-Array packages, Delamination, Flip-chip, Flip-chip devices, Fracture (Materials), Shrinkage (Materials), Stress, Temperature, Epoxy resins, Molding
Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
Open the PDF for Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling in another window
Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls

Krishna Tunga, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 427–433.
https://doi.org/10.1115/1.2804091
Published Online: February 13, 2007
View Article titled, An Expedient Experimental Technique for the Determination of Thermal Cycling Fatigue Life for BGA Package Solder Balls
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Topics: Ball-Grid-Array packaging, Ceramics, Fatigue life, Solders, Ball-Grid-Array packages, Interferometry, Lasers
Journal Articles

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Sandeep S. Tonapi, Sanjeev B. Sathe, Bahgat G. Sammakia, K. Srihari
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 305–310.
https://doi.org/10.1115/1.2351891
Published Online: February 10, 2006
View Article titled, A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages
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Topics: Air flow, Ball-Grid-Array packages, Energy dissipation, Forced convection, Heat, Heat transfer, Numerical analysis, Temperature, Junctions, Temperature distribution
Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
https://doi.org/10.1115/1.1827260
Published Online: January 24, 2005
View Article titled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages
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Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions
Journal Articles

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

Hamid Hadim, Tohru Suwa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
https://doi.org/10.1115/1.1997161
Published Online: November 16, 2004
View Article titled, A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks
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Topics: Artificial neural networks, Design, Optimization, Ball-Grid-Array packaging, Ball-Grid-Array packages, Solders
Journal Articles

Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition

Seungmin Cho, Bongtae Han, Mem. ASME, Jinwon Joo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 41–47.
https://doi.org/10.1115/1.1646426
Published Online: April 30, 2004
View Article titled, Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition
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Topics: Ceramics, Deformation, Manufacturing, Solders, Temperature, Interferometry, Ball-Grid-Array packages, Stress, Displacement
Journal Articles

Thermomechanical Durability of High I/O BGA Packages

P. Davuluri, S. Shetty, A. Dasgupta, S. Young
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 266–270.
https://doi.org/10.1115/1.1477192
Published Online: July 26, 2002
View Article titled, Thermomechanical Durability of High I/O BGA Packages
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Topics: Ball-Grid-Array packages, Cycles, Durability, Failure, Modeling, Solder joints, Solders, Stress, Stress analysis (Engineering), Thermomechanics
Journal Articles

A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package

Sarang Shidore, Tien Yu Tom Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 232–237.
https://doi.org/10.1115/1.1349423
Published Online: November 27, 2000
View Article titled, A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package
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Topics: Computational fluid dynamics, Forced convection, Junctions, Natural convection, Network models, Resistors, Temperature, Optimization, Ball-Grid-Array packaging, Modeling
Journal Articles

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

J. Lau, T. Chen, S.-W. R. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 242–248.
https://doi.org/10.1115/1.2793847
Published Online: December 1, 1999
View Article titled, Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages
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Topics: Ball-Grid-Array packages, Cavities, Flat heat pipes, Ball-Grid-Array packaging, Cooling, Epoxy adhesives, Epoxy resins, Glass, Printed circuit boards, Solders
Journal Articles

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 163–170.
https://doi.org/10.1115/1.2792229
Published Online: September 1, 1997
View Article titled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints
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Topics: Ball-Grid-Array packaging, Solder joints, Reliability, Deformation, Finite element analysis, Manufacturing, Ball-Grid-Array packages, Ceramics, Computation, Constitutive equations
Journal Articles

Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package

J. H. Lau, K.-L. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1997, 119(3): 208–212.
https://doi.org/10.1115/1.2792236
Published Online: September 1, 1997
View Article titled, Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Copper, Deflection, Epoxy adhesives, Epoxy resins, Flat heat pipes, Glass, Printed circuit boards, Temperature distribution
Journal Articles

Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models

G. Subbarayan, Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 148–156.
https://doi.org/10.1115/1.2792145
Published Online: September 1, 1996
View Article titled, Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models
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Topics: Artificial neural networks, Engineering simulation, Finite element analysis, Reliability, Simulation, Solder joints, Design, Manufacturing, Finite element model, Ball-Grid-Array packages
Journal Articles

Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability

Teh-Hua Ju, Wei Lin, Y. C. Lee, Jay J. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 242–248.
https://doi.org/10.1115/1.2905694
Published Online: December 1, 1994
View Article titled, Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability
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Topics: Ball-Grid-Array packaging, Ceramics, Manufacturing, Reliability, Solder joints, Printed circuit boards, Fatigue, Fatigue life, Solders, Ball-Grid-Array packages