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Journal Articles

Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041119.
Paper No: EP-24-1050
https://doi.org/10.1115/1.4066320
Published Online: September 12, 2024
View Article titled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
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Topics: Aerosols, Cantilevers, Durability, Extruding, Finite element analysis, Silver, Testing, Printing, Shock (Mechanics), Strain gages
Journal Articles

Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures

Nobuyuki Shishido, Yutaka Hayama, Yuki Akinaga, Shinya Taketomi, Masaaki Koganemaru, Seiya Hagihara, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011010.
Paper No: EP-24-1039
https://doi.org/10.1115/1.4066100
Published Online: August 24, 2024
View Article titled, Application of the Nonlinear Fracture Mechanics Parameter Δ T * to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
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Topics: Creep, Cycles, Fatigue, Fracture (Materials), Fracture mechanics, Temperature, Wire, Computational methods, Finite element analysis
Journal Articles

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
https://doi.org/10.1115/1.4064521
Published Online: March 11, 2024
View Article titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
Open the PDF for Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging in another window
Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Viscoplasticity, Finite element analysis
Journal Articles

Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis

Yue Huang, Shang-Shu Li, Yan-Pei Gao, Hai-Bin Zhu, Gao-Yin He, Xiao-Hui Xie, Chun Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031004.
Paper No: EP-23-1045
https://doi.org/10.1115/1.4064703
Published Online: February 28, 2024
View Article titled, Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis
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Topics: Compression, Deformation, Finite element analysis, Flip-chip, Materials properties, Modeling, Bonding, Manufacturing
Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
View Article titled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling
Journal Articles

Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals

Abhishek Deshpande, Aniket Bharamgonda, Qian Jiang, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041102.
Paper No: EP-23-1038
https://doi.org/10.1115/1.4063325
Published Online: October 5, 2023
View Article titled, Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals
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Topics: Anisotropy, Cooling, Crystals, Finite element analysis, Grain size, Shear (Mechanics), Solder joints, Solders, Stress, Tin
Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Article titled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
View Article titled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles
Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
https://doi.org/10.1115/1.4054784
Published Online: August 3, 2022
View Article titled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure
Journal Articles

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

Louis Schuler, Ludovic Chamoin, Zoubir Khatir, Mounira Berkani, Merouane Ouhab, Nicolas Degrenne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031013.
Paper No: EP-21-1138
https://doi.org/10.1115/1.4053767
Published Online: March 7, 2022
View Article titled, A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
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Topics: Design, Solder joints, Temperature, Thermomechanics, Geometry, Finite element analysis, Convection, Cycles, Sensitivity analysis
Journal Articles

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
https://doi.org/10.1115/1.4053121
Published Online: February 7, 2022
View Article titled, Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model
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Topics: Engines, Finite element analysis, Lamination, Motors, Stators, Temperature, Thermal conductivity, Winding (process), Sensitivity analysis, Contact resistance
Journal Articles

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Qiming Zhang, S. W. Ricky Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041010.
Paper No: EP-21-1030
https://doi.org/10.1115/1.4053309
Published Online: January 28, 2022
View Article titled, Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing
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Topics: Failure, Shear (Mechanics), Testing, Finite element analysis
Journal Articles

Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration

Geoffrey A. Garcia, Kody Wakumoto, Joseph J. Brown
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041004.
Paper No: EP-21-1018
https://doi.org/10.1115/1.4052325
Published Online: November 22, 2021
View Article titled, Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration
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Topics: Cantilevers, Design, Deflection, Microfabrication, Metamaterials, Modeling, Finite element analysis, Stress
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Article titled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021106.
Paper No: EP-21-1010
https://doi.org/10.1115/1.4052070
Published Online: October 6, 2021
View Article titled, Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping
Journal Articles

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta, Ulrich Becker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031006.
Paper No: EP-21-1025
https://doi.org/10.1115/1.4051647
Published Online: September 15, 2021
View Article titled, Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints
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Topics: Damage, Durability, Fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Finite element analysis, Fatigue damage, Hydrostatics
Journal Articles

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

Chang-Chun Lee, Kuo-Shu Kao, Chi-Wei Wang, Tai-Jyun Yu, Tai-Kuang Lee, Po-Kai Chiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
https://doi.org/10.1115/1.4052072
Published Online: September 13, 2021
View Article titled, Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate
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Topics: Manufacturing, Metals, Molding materials, Reliability, Silicones, Solders, Epoxy resins, Finite element analysis, Mechanical behavior
Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Article titled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
Open the PDF for Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals in another window
Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
View Article titled, Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis