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Journal Articles

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041112.
Paper No: EP-24-1042
https://doi.org/10.1115/1.4066044
Published Online: August 9, 2024
View Article titled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
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Topics: Cooling, Elastic moduli, Fluids, Temperature, Thermomechanics, Heat, Energy dissipation, Glass transition, Data centers, Reliability
Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
https://doi.org/10.1115/1.4054784
Published Online: August 3, 2022
View Article titled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure
Journal Articles

Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021113.
Paper No: EP-21-1059
https://doi.org/10.1115/1.4052715
Published Online: January 4, 2022
View Article titled, Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation
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Topics: Flip-chip, Glass transition, High temperature, Mechanical properties, Oxidation, Solders, Storage, Temperature, Viscoelasticity, Optical microscopes
Journal Articles

Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound

Ruifeng Li, Daoguo Yang, Ping Zhang, Fanfan Niu, Miao Cai, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011009.
Paper No: EP-18-1065
https://doi.org/10.1115/1.4047475
Published Online: June 26, 2020
View Article titled, Effects of High-Temperature Storage on the Glass Transition Temperature of Epoxy Molding Compound
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Topics: Epoxy resins, Glass transition, High temperature, Molding, Storage, Temperature, Epoxy adhesives
Journal Articles

Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture

Jing-Yao Chang, Shin-Yi Huang, Chang-Chun Lee, Tung-Han Chuang, Tao-Chih Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031007.
Paper No: EP-14-1083
https://doi.org/10.1115/1.4030392
Published Online: September 1, 2015
View Article titled, Influence of Glass Transition Temperature of Underfill on the Stress Behavior and Reliability of Microjoints Within a Chip Stacking Architecture
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Topics: Cycles, Glass transition, Reliability, Solders, Stress, Temperature, Numerical analysis, Failure, Tin, Failure mechanisms
Journal Articles

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011013.
Paper No: EP-13-1091
https://doi.org/10.1115/1.4026626
Published Online: February 18, 2014
View Article titled, Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures
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Topics: Boiling, Polymers, Temperature, Water, Weight (Mass), Glass transition, Absorption
Journal Articles

Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array

Tong Hong Wang, Yi-Shao Lai, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
https://doi.org/10.1115/1.1827271
Published Online: January 24, 2005
View Article titled, Effect of Underfill Thermomechanical Properties on Thermal Cycling Fatigue Reliability of Flip-Chip Ball Grid Array
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Topics: Ball-Grid-Array packaging, Creep, Fatigue, Flip-chip, Materials properties, Reliability, Solders, Thermomechanics, Shear (Mechanics), Finite element analysis
Journal Articles

A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film

Naotaka Tanaka, Senior Researcher, Kenya Kawano, Researcher, Hideo Miura, Chief Researcher, Yoshiyuki Kado, Engineer, Ikuo Yoshida, Senior Engineer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 82–86.
https://doi.org/10.1115/1.1648059
Published Online: April 30, 2004
View Article titled, A Highly Reliable Design for a Nonmetallurgical Contact-Joint Structure Consisting of an Adhesive Film
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Topics: Adhesives, Deformation, Relaxation (Physics), Reliability, Stress, Temperature, Design, Glass transition, Elasticity
Journal Articles

Warpage of Plastic IC Packages as a Function of Processing Conditions

Dickson T. S. Yeung, Matthew M. F. Yuen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 268–272.
https://doi.org/10.1115/1.1349421
Published Online: December 22, 1999
View Article titled, Warpage of Plastic IC Packages as a Function of Processing Conditions
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Topics: Molding, Warping, Finite element analysis, Temperature, Shear modulus, Thermal expansion, Glass transition, Thermal characterization
Journal Articles

Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications

N. R. Sottos, J. M. Ockers, M. Swindeman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 37–43.
https://doi.org/10.1115/1.2792659
Published Online: March 1, 1999
View Article titled, Thermoelastic Properties of Plain Weave Composites for Multilayer Circuit Board Applications
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Topics: Composite materials, Printed circuit boards, Thermoelasticity, Textiles, Geometry, Lumber, Elastic moduli, Epoxy adhesives, Epoxy resins, Fibers
Journal Articles

A Rubbery Cure Shrinkage Model for Analyzing Encapsulated Assemblies

R. S. Chambers, R. R. Lagasse, T. R. Guess, D. J. Plazek, C. Bero
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1995, 117(3): 249–254.
https://doi.org/10.1115/1.2792101
Published Online: September 1, 1995
View Article titled, A Rubbery Cure Shrinkage Model for Analyzing Encapsulated Assemblies
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Topics: Shrinkage (Materials), Hardening (Curing), Epoxy resins, Finite element analysis, Stress, Temperature, Constitutive equations, Cooling, Damage, Delamination