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Journal Articles

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

Reinhard E. Powell, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021006.
https://doi.org/10.1115/1.3103938
Published Online: April 1, 2009
View Article titled, A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process
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Topics: Warping, Printed circuit boards, Measurement systems, Resolution (Optics)
Journal Articles

A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements

Reena Cole, Mark Davies, Jeff Punch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 480–489.
https://doi.org/10.1115/1.1604811
Published Online: December 15, 2003
View Article titled, A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements
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Topics: Flat plates, Flow (Dynamics), Temperature, Thermal conductivity, Thermal resistance, Vehicles, Reynolds number, Boundary layers, Junctions, Measurement systems
Journal Articles

Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes

G. Rodriguez, D. F. Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 169–178.
https://doi.org/10.1115/1.2792680
Published Online: September 1, 1999
View Article titled, Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes
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Topics: Printing, Solders, Electronic packaging, Adhesives, Analytical methods, Ball-Grid-Array packaging, Flip-chip, Flip-chip devices, Imaging, Measurement systems
Journal Articles

System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage

M. R. Stiteler, I. C. Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 1–7.
https://doi.org/10.1115/1.2792196
Published Online: March 1, 1997
View Article titled, System for Real-Time Measurement of Thermally Induced PWB/PWA Warpage
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Topics: Printed circuit boards, Warping, Reflow soldering, Measurement systems, Shades and shadows, Soldering, Vehicles