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Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
DOI: https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces

Cheng-Hui Lin, Yoonjin Won
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
DOI: https://doi.org/10.1115/1.4052790
Published Online: November 9, 2021
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Topics: Boiling, Bubbles, Critical heat flux, Electrodeposition, Heat transfer, Copper, Dynamics (Mechanics), Microscale devices, Fins, Flow (Dynamics)
Includes: Supplementary data
Journal Articles

Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging

Ronald J. Warzoha
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. June 2021, 143(2): 020301.
Paper No: EP-21-1004
DOI: https://doi.org/10.1115/1.4050407
Published Online: March 19, 2021
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Topics: Electronic packaging, Microscale devices, Nanoscale phenomena, Storage
Journal Articles

Multiscale Evaporation Rate Measurement Using Microlaser-Induced Fluorescence

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031105.
Paper No: EP-19-1137
DOI: https://doi.org/10.1115/1.4046767
Published Online: April 17, 2020
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Topics: Evaporation, Fluorescence, Temperature, Vapors, Microscale devices
Includes: Supplementary data
Journal Articles

Fabrication and Bioconjugation of Micro- and Nanoscale Structures Intended for Cancer-Specific Antigen Detection

Kevin M. Klein, Gregory Ostrowicki, Andrew T. Gewirtz, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021014.
DOI: https://doi.org/10.1115/1.3103937
Published Online: April 28, 2009
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Topics: Cancer, Manufacturing, Microscale devices, Nanoscale phenomena, Proteins, Electron beams, Lithography, Biomaterials
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
DOI: https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface

X. J. Wei, Y. K. Joshi, P. M. Ligrani
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
DOI: https://doi.org/10.1115/1.2429711
Published Online: March 2, 2006
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Topics: Flow (Dynamics), Heat transfer, Laminar flow, Microchannels, Microscale devices, Computer simulation
Journal Articles

Three-Dimensional Effects of Solder Joints in Micro-Scale BGA Assembly

J. Zhu
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 297–302.
DOI: https://doi.org/10.1115/1.2793856
Published Online: December 1, 1999
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Topics: Ball-Grid-Array packaging, Manufacturing, Microscale devices, Solder joints, Creep, Design, Solders, Cycles, Modeling, Reliability
Journal Articles

A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling

A. Chandra, Y. Huang, Z. Q. Jiang, K. X. Hu, G. Fu
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 220–226.
DOI: https://doi.org/10.1115/1.1286100
Published Online: November 5, 1999
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Topics: Damage, Fracture (Materials), Nucleation (Physics), Stress, Cycles, Microscale devices