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Journal Articles

Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes

Bikramjit Chatterjee, James Spencer Lundh, Daniel Shoemaker, Tae Kyoung Kim, Hoyeon Kim, Noel C. Giebnik, Joon Seop Kwak, Jaehee Cho, Sukwon Choi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031111.
Paper No: EP-20-1015
DOI: https://doi.org/10.1115/1.4047015
Published Online: May 13, 2020
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Topics: Gallium nitride, Heating, Light-emitting diodes, Nanoparticles, Temperature, Temperature measurement, Microscopy
Journal Articles

Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications

Vana Snigdha Tummala, Ahsan Mian, Nowrin H. Chamok, Dhruva Poduval, Mohammod Ali, Jallisa Clifford, Prasun Majumdar
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020904.
Paper No: EP-16-1137
DOI: https://doi.org/10.1115/1.4036384
Published Online: June 12, 2017
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Topics: Additive manufacturing, Density, Dimensions, X-rays, Resonance, Microscopy, Manufacturing, Porosity, Design
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
DOI: https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
DOI: https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon
Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
DOI: https://doi.org/10.1115/1.1846062
Published Online: June 3, 2005
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Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation
Journal Articles

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 172–177.
DOI: https://doi.org/10.1115/1.483151
Published Online: May 21, 1999
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Topics: Acoustics, Capacitors, Ceramics, Delamination, Nondestructive evaluation, Testing, Microscopy, Thermal shock, Reliability, Failure analysis
Journal Articles

Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)

S. A. Taylor, K. Chen, R. Mahajan
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 85–88.
DOI: https://doi.org/10.1115/1.2792224
Published Online: June 1, 1997
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Topics: Acoustics, Computers, Cracking (Materials), Equilibrium (Physics), Fracture (Process), Heat, Heating, High temperature, Lumber, Microscopy
Journal Articles

Experimental Investigation of the Formation of Surface Mount Solder Joints

P. P. Conway, M. R. Kalantary, D. J. Williams
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 223–228.
DOI: https://doi.org/10.1115/1.2792156
Published Online: December 1, 1996
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Topics: Solder joints, Surface mount packaging, Solders, Computers, Manufacturing, Microscopy, Process design, Reflow soldering, Temperature, Wetting
Journal Articles

Advances in Bonding Technology for Electronic Packaging

Chin C. Lee, Chen Y. Wang, Goran Matijasevic
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 201–207.
DOI: https://doi.org/10.1115/1.2909318
Published Online: June 1, 1993
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Topics: Bonding, Electronic packaging, Alloys, Temperature, Acoustics, Diffusion (Physics), Melting point, Microscopy, Oxidation, Soldering
Journal Articles

Oil Films on Electroplated Gold Contact Surfaces

R. G. Bayer, K. M. Conrow, P. A. Lazarou
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 1989, 111(3): 236–240.
DOI: https://doi.org/10.1115/1.3226539
Published Online: September 1, 1989
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Topics: Coating processes, Coatings, Friction, Lubricants, Metallurgy, Microscopy, Polarization (Light), Shapes, Wear