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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041122.
Paper No: EP-24-1043
Published Online: October 22, 2024
Journal Articles
Accepted Manuscript
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1038
Published Online: July 20, 2024
Journal Articles
Jun Wang, Yang Zhao, Han Chen, Yan Tang, Guozhen Liu, Renli Liang, Jiangnan Dai, Changqing Chen, Junyong Kang, Duanjun Cai
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031102.
Paper No: EP-19-1120
Published Online: April 17, 2020
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
Published Online: September 19, 2014
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2014, 136(4): 044501.
Paper No: EP-13-1132
Published Online: September 19, 2014
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
Published Online: November 13, 2008
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
Published Online: December 14, 2006