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Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke

J. Electron. Packag. September 2023, 145(3): 031008.

Paper No: EP-22-1082

DOI: https://doi.org/10.1115/1.4056992

Published Online: March 8, 2023

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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure

Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee

J. Electron. Packag. June 2022, 144(2): 021118.

Paper No: EP-21-1038

DOI: https://doi.org/10.1115/1.4053948

Published Online: March 28, 2022

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Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks

Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. December 2022, 144(4): 041009.

Paper No: EP-21-1137

DOI: https://doi.org/10.1115/1.4052920

Published Online: December 1, 2021

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Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation

Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer

J. Electron. Packag. December 2021, 143(4): 041106.

Paper No: EP-21-1120

DOI: https://doi.org/10.1115/1.4052465

Published Online: October 13, 2021

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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors

Journal Articles

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Aniket Ajay Lad, Kai A. James, William P. King, Nenad Miljkovic

J. Electron. Packag. December 2021, 143(4): 041105.

Paper No: EP-21-1112

DOI: https://doi.org/10.1115/1.4052400

Published Online: October 6, 2021

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Topics: Design, Flow (Dynamics), Optimization, Pressure drop, Heat sinks

Journal Articles

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. June 2022, 144(2): 021104.

Paper No: EP-20-1142

DOI: https://doi.org/10.1115/1.4052074

Published Online: September 24, 2021

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Topics: Composite materials, Energy storage, Thermal conductivity, Electronics, Optimization, Temperature, Design, Heat sinks, Latent heat, Phase change materials

Journal Articles

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Raj Sahu, Emre Gurpinar, Burak Ozpineci

J. Electron. Packag. June 2022, 144(2): 021103.

Paper No: EP-21-1019

DOI: https://doi.org/10.1115/1.4052068

Published Online: September 15, 2021

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Topics: Design, Heat sinks, Optimization, Temperature

Journal Articles

Underfill Flow in Flip-Chip Encapsulation Process: A Review

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. March 2022, 144(1): 010803.

Paper No: EP-21-1007

DOI: https://doi.org/10.1115/1.4050697

Published Online: August 6, 2021

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Topics: Flow (Dynamics), Flip-chip, Fluids, Optimization, Design, Reliability

Journal Articles

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Rajesh Kasukurthy, Amruthavalli Rachakonda, Dereje Agonafer

J. Electron. Packag. September 2021, 143(3): 031001.

Paper No: EP-20-1016

DOI: https://doi.org/10.1115/1.4049018

Published Online: January 19, 2021

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Topics: Computational fluid dynamics, Coolants, Cooling, Flow (Dynamics), Flow control, Matlab, Optimization, Plates (structures), Temperature, Testing

Journal Articles

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. June 2021, 143(2): 021007.

Paper No: EP-19-1111

DOI: https://doi.org/10.1115/1.4048590

Published Online: October 30, 2020

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Topics: Design, Electrical resistivity, Flow (Dynamics), Pumps, Temperature, Optimization, Microchannels, Coolants, Pareto optimization, Heat flux

Journal Articles

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L, Huanyu Liao, Ganesh Subbarayan

J. Electron. Packag. December 2020, 142(4): 041005.

Paper No: EP-20-1011

DOI: https://doi.org/10.1115/1.4048729

Published Online: October 28, 2020

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Topics: Algorithms, Particulate matter, Optimization, Network models

Journal Articles

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Reece Whitt, Skyler Hudson, David Huitink, Zhao Yuan, Asif Emon, Fang Luo

J. Electron. Packag. December 2020, 142(4): 041004.

Paper No: EP-20-1034

DOI: https://doi.org/10.1115/1.4048493

Published Online: October 12, 2020

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Topics: Additive manufacturing, Coolants, Cooling, Design, Electromagnetic interference, Flat heat pipes, Flow (Dynamics), Fluids, Heat, Heat transfer

Journal Articles

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Steven A. Isaacs, Caelan Lapointe, Peter E. Hamlington

J. Electron. Packag. March 2021, 143(1): 011010.

Paper No: EP-19-1130

DOI: https://doi.org/10.1115/1.4047576

Published Online: July 10, 2020

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Topics: Design, Heat pipes, Optimization, Vapors, Flat heat pipes, Temperature, Condensers (steam plant), Computational fluid dynamics, Heat, Satellites

Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041109.

Paper No: EP-19-1123

DOI: https://doi.org/10.1115/1.4047471

Published Online: June 29, 2020

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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems

Journal Articles

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Jie Liu, Jinglong Zou, Sheng Liu

J. Electron. Packag. March 2021, 143(1): 011003.

Paper No: EP-19-1078

DOI: https://doi.org/10.1115/1.4046762

Published Online: June 4, 2020

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Topics: Energy dissipation, Heat, Light-emitting diodes, Optimization, Phosphors, Temperature, Junctions, Natural convection, Thermal analysis, Fins

Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou

J. Electron. Packag. September 2019, 141(3): 031008.

Paper No: EP-18-1108

DOI: https://doi.org/10.1115/1.4043482

Published Online: May 17, 2019

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Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms

Journal Articles

Simultaneous Optimization of an Array of Heat Sinks

Georgios Karamanis, Marc Hodes

J. Electron. Packag. June 2019, 141(2): 021001.

Paper No: EP-18-1068

DOI: https://doi.org/10.1115/1.4042668

Published Online: February 25, 2019

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Topics: Computational fluid dynamics, Flow (Dynamics), Heat sinks, Optimization, Circuits, Coolants, Modeling

Journal Articles

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Weijun Zhu, Gang Dong, Yintang Yang

J. Electron. Packag. December 2018, 140(4): 041002.

Paper No: EP-18-1007

DOI: https://doi.org/10.1115/1.4040670

Published Online: August 3, 2018

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Topics: Density, Design, Heat, Modeling, Optimization, Silicon, Temperature, Simulation, Energy dissipation, Gates (Closures)

Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua

J. Electron. Packag. March 2018, 140(1): 010905.

Paper No: EP-17-1099

DOI: https://doi.org/10.1115/1.4039026

Published Online: March 2, 2018

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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms

Journal Articles

Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications

Steven A. Isaacs, Diego A. Arias, Derek Hengeveld, Peter E. Hamlington

J. Electron. Packag. June 2017, 139(2): 020910.

Paper No: EP-16-1142

DOI: https://doi.org/10.1115/1.4036406

Published Online: June 12, 2017

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Topics: Heat, Optimization, Temperature

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Journal citation

NARROW

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Reduced Order Design Optimization of Liquid Cooled Heat Sinks

Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model

Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules

Underfill Flow in Flip-Chip Encapsulation Process: A Review

Design and Optimization of Control Strategy to Reduce Pumping Power in Dynamic Liquid Cooling

Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Simultaneous Optimization of an Array of Heat Sinks

Power and Thermal Constraints-Driven Modeling and Optimization for Through Silicon Via-Based Power Distribution Network

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Experimental Development and Computational Optimization of Flat Heat Pipes for CubeSat Applications

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