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Journal Articles

High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band

El Amjed Hajlaoui, Ziyad M. Almohaimeed, Abdullah Almohaimeed, Wazie Abdulkawi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011002.
Paper No: EP-23-1079
https://doi.org/10.1115/1.4065145
Published Online: April 12, 2024
View Article titled, High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band
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Topics: Biomedicine, Energy gap, Radiation (Physics), Design, Reflectance, Surface waves (Fluid)
Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO 2 /Graphite Bilayered Packaging Structure

Zong-Tao Li, Jun-Hao Wu, Zhi-yao Ren, Yao-xing Song, Jia-Sheng Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011010.
Paper No: EP-20-1129
https://doi.org/10.1115/1.4050202
Published Online: August 6, 2021
View Article titled, Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO 2 /Graphite Bilayered Packaging Structure
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Topics: Electromagnetic scattering, Graphite, Light-emitting diodes, Nanoparticles, Packaging, Radiation (Physics)
Journal Articles

Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins

A. Tamayol, F. McGregor, M. Bahrami
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2012, 134(3): 034501.
https://doi.org/10.1115/1.4007077
Published Online: July 24, 2012
View Article titled, Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins
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Topics: Fins, Heat transfer, Natural convection, Radiation (Physics), Temperature
Journal Articles

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Jing He, Liping Liu, Anthony M. Jacobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
https://doi.org/10.1115/1.4005299
Published Online: November 17, 2011
View Article titled, Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel
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Topics: Convection, Emissivity, Heat, Radiation (Physics), Temperature, Thermal analysis, Thermal conductivity, Heat transfer, Heat conduction, Flow (Dynamics)
Journal Articles

A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

Matthew Sweetland, John H. Lienhard, V, Alexander H. Slocum
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031012.
https://doi.org/10.1115/1.2966437
Published Online: August 12, 2008
View Article titled, A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing
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Topics: Convection, Cooling, Lasers, Nozzles, Radiation (Physics), Temperature, Temperature control, Testing, Manifolds, Pressure
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Article titled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection
Journal Articles

Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications

Patricia F. Mead, Aravind Ramamoorthy, Shapna Pal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 294–301.
https://doi.org/10.1115/1.1571076
Published Online: June 10, 2003
View Article titled, Investigation of Variable Frequency Microwave Processing for Electronic Packaging Applications
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Topics: Failure, Failure analysis, Microwaves, Proton exchange membranes, Radiation (Physics), Stress, Delamination, Heating, Leakage, Electronic packaging
Journal Articles

Transient Thermal Management of a Handset Using Phase Change Material (PCM)

Marc Hodes, Randy D. Weinstein, Stephen J. Pence, Jason M. Piccini, Lou Manzione, Calvin Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 419–426.
https://doi.org/10.1115/1.1523061
Published Online: December 12, 2002
View Article titled, Transient Thermal Management of a Handset Using Phase Change Material (PCM)
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Topics: Heat transfer, Natural convection, Phase change materials, Steady state, Temperature, Thermal management, Transients (Dynamics), Radiation (Physics), Thermocouples, Heat
Journal Articles

A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 107–114.
https://doi.org/10.1115/1.483141
Published Online: October 1, 1999
View Article titled, A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
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Topics: Ball-Grid-Array packaging, Heat sinks, Heat transfer, Junctions, Modeling, Natural convection, Radiation (Physics), Solders, Temperature, Thermal conductivity
Journal Articles

Thermal Management Strategies for Embedded Electronic Components of Wearable Computers

Eric Egan, Cristina H. Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 98–106.
https://doi.org/10.1115/1.483140
Published Online: September 15, 1999
View Article titled, Thermal Management Strategies for Embedded Electronic Components of Wearable Computers
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Topics: Computer simulation, Computers, Design, Electronics, Flat heat pipes, Heat, Polymer composites, Temperature, Thermal conductivity, Thermal management
Journal Articles

Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction

D. A. Hall, G. C. Vliet, T. L. Bergman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 75–84.
https://doi.org/10.1115/1.2792671
Published Online: June 1, 1999
View Article titled, Natural Convection Cooling of Vertical Rectangular Channels in Air Considering Radiation and Wall Conduction
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Topics: Cooling, Heat conduction, Natural convection, Radiation (Physics), Temperature, Wall temperature, Emissivity, Plates (structures), Separation (Technology), Temperature distribution
Journal Articles

Integrated Infrared Failure Analysis of Printed Circuit Boards

J. J. Miles, C. R. Zelak, J. M. Kliman, J. E. Sunderland
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 288–293.
https://doi.org/10.1115/1.2792107
Published Online: December 1, 1995
View Article titled, Integrated Infrared Failure Analysis of Printed Circuit Boards
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Topics: Failure analysis, Printed circuit boards, Testing, Heat transfer, Infrared imaging, Manufacturing, Radiation (Physics)
Journal Articles

Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient

Ann M. Anderson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 310–316.
https://doi.org/10.1115/1.2905703
Published Online: December 1, 1994
View Article titled, Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient
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Topics: Heat transfer, Heat transfer coefficients, Convection, Heat conduction, Temperature, Radiation (Physics), Computation, Computer cooling, Ducts, Errors
Journal Articles

Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module

C. Beckermann, T. F. Smith, B. Pospichal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 126–133.
https://doi.org/10.1115/1.2905500
Published Online: June 1, 1994
View Article titled, Use of a Two-Dimensional Simulation Model in the Thermal Analysis of a Multi-Board Electronic Module
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Topics: Simulation models, Thermal analysis, Heat transfer, Radiation (Physics), Air flow, Convection, Drag (Fluid dynamics), Geometry, Heat conduction, Heat losses
Journal Articles

A Detailed Thermal Model of the Infrared Reflow Soldering Process

M. A. Eftychiou, T. L. Bergman, G. Y. Masada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 55–62.
https://doi.org/10.1115/1.2909302
Published Online: March 1, 1993
View Article titled, A Detailed Thermal Model of the Infrared Reflow Soldering Process
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Topics: Reflow soldering, Heat conduction, Heat transfer, Mixed convection, Convection, Manufacturing, Ovens, Radiation (Physics), Solders, Temperature effects
Journal Articles

Combined Conduction, Natural Convection, and Radiation Heat Transfer in an Electronic Chassis

T. F. Smith, C. Beckermann, S. W. Weber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 382–391.
https://doi.org/10.1115/1.2905424
Published Online: December 1, 1991
View Article titled, Combined Conduction, Natural Convection, and Radiation Heat Transfer in an Electronic Chassis
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Topics: Heat conduction, Heat transfer, Natural convection, Radiation (Physics), Electronic packages, Computer simulation, Design, Electronic components, Heat, Printed circuit boards
Journal Articles

An Investigation of the Passive Cooling of Table Model Television Receivers

M. S. Yuki, J. R. Parsons, R. J. Krane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 279–287.
https://doi.org/10.1115/1.2904380
Published Online: December 1, 1990
View Article titled, An Investigation of the Passive Cooling of Table Model Television Receivers
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Topics: Cooling, Vents, Natural convection, Design, Engineers, Flow (Dynamics), Computer simulation, Electronic products, Flow visualization, Heat transfer
Journal Articles

Conjugate Heat Transfer From a Vertical Plate With Discrete Heat Sources Under Natural Convection

S. Lee, M. M. Yovanovich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1989, 111(4): 261–267.
https://doi.org/10.1115/1.3226545
Published Online: December 1, 1989
View Article titled, Conjugate Heat Transfer From a Vertical Plate With Discrete Heat Sources Under Natural Convection
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Topics: Heat, Heat transfer, Natural convection, Vertical plates, Fluids, Radiation (Physics), Temperature, Boundary layers, Clearances (Engineering), Convection