1-20 of 72
Reynolds number
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Converging Jet Impingement for Enhanced Liquid Cooling

Reece Whitt, Rafael Estrella, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
https://doi.org/10.1115/1.4063484
Published Online: October 9, 2023
View Article titled, Converging Jet Impingement for Enhanced Liquid Cooling
Open the PDF for Converging Jet Impingement for Enhanced Liquid Cooling in another window
Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation
Journal Articles

Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Prabhakar Subrahmanyam, B. K. Gnanavel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031009.
Paper No: EP-20-1104
https://doi.org/10.1115/1.4049579
Published Online: February 19, 2021
View Article titled, Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets
Open the PDF for Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets in another window
Topics: Flow (Dynamics), Heat transfer, Heat transfer coefficients, Jets, Nozzles, Reynolds-averaged Navier–Stokes equations, Silicon, Reynolds number, Turbulence, Temperature
Journal Articles

Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams

Varun Prasanna Rajamuthu, Sanskar S. Panse, Srinath Ekkad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031003.
Paper No: EP-20-1090
https://doi.org/10.1115/1.4049173
Published Online: January 19, 2021
View Article titled, Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams
Open the PDF for Heat Transfer Enhancement Through Array Jet Impingement on Strategically Placed High Porosity High Pore-Density Thin Copper Foams in another window
Topics: Density, Foams (Chemistry), Heat transfer, Porosity, Reynolds number, Metal foams, Copper, Flow (Dynamics), Jets
Journal Articles

Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger

Hua Zhu, Zhuo Yang, Tariq Amin Khan, Wei Li, Zhijian Sun, Jincai Du, Zhengjiang Zhang, Jianxin Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
https://doi.org/10.1115/1.4043482
Published Online: May 17, 2019
View Article titled, Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger
Open the PDF for Thermal-Hydraulic Performance and Optimization of Tube Ellipticity in a Plate Fin-And-Tube Heat Exchanger in another window
Topics: Artificial neural networks, Computational fluid dynamics, Computer simulation, Flow (Dynamics), Heat exchangers, Heat transfer, Optimization, Friction, Reynolds number, Genetic algorithms
Journal Articles

Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop

Chirag R. Kharangate, Ki Wook Jung, Sangwoo Jung, Daeyoung Kong, Joseph Schaadt, Madhusudan Iyengar, Chris Malone, Hyoungsoon Lee, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021001.
Paper No: EP-17-1126
https://doi.org/10.1115/1.4039475
Published Online: May 9, 2018
View Article titled, Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop
Open the PDF for Experimental Investigation of Embedded Micropin-Fins for Single-Phase Heat Transfer and Pressure Drop in another window
Topics: Fins, Flow (Dynamics), Fluids, Friction, Heat transfer, Pressure drop, Reynolds number, Water, Heat, Temperature
Journal Articles

Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031015.
Paper No: EP-15-1041
https://doi.org/10.1115/1.4030953
Published Online: September 1, 2015
View Article titled, Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements
Open the PDF for Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements in another window
Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Nozzles, Reynolds number, Jets, Temperature, Heat flux
Journal Articles

Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

Gongnan Xie, Masoud Asadi, Bengt Sunden, Shaofei Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031013.
Paper No: EP-13-1138
https://doi.org/10.1115/1.4027728
Published Online: June 10, 2014
View Article titled, Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime
Open the PDF for Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime in another window
Topics: Design, Flow (Dynamics), Geometry, Heat transfer, Optimization, Reynolds number, Thermal resistance, Vortices, Wavelength, Degrees of freedom
Journal Articles

Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating Plate

Esam M. Alawadhi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031003.
Paper No: EP-13-1046
https://doi.org/10.1115/1.4027090
Published Online: May 5, 2014
View Article titled, Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating Plate
Open the PDF for Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating Plate in another window
Topics: Flow (Dynamics), Heat transfer, Pressure drop, Reynolds number
Journal Articles

Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling

Gongnan Xie, Jian Liu, Yanquan Liu, Bengt Sunden, Weihong Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021008.
Paper No: EP-12-1104
https://doi.org/10.1115/1.4023530
Published Online: March 28, 2013
View Article titled, Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling
Open the PDF for Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling in another window
Topics: Heat transfer, Microchannels, Heat sinks, Pressure drop, Reynolds number, Flow (Dynamics)
Journal Articles

Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

Gongnan Xie, Jian Liu, Weihong Zhang, Bengt Sunden
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041010.
https://doi.org/10.1115/1.4023035
Published Online: December 6, 2012
View Article titled, Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling
Open the PDF for Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling in another window
Topics: Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Cooling, Reynolds number
Journal Articles

Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers

Dae Hee Lee, Jong Ryeol Bae, Mira Ryu, Phil Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041004.
https://doi.org/10.1115/1.4007317
Published Online: September 4, 2012
View Article titled, Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers
Open the PDF for Confined, Milliscale Unsteady Laminar Impinging Slot Jets: Effects of Slot Width on Surface Stagnation Point Nusselt Numbers in another window
Topics: Jets, Nozzles, Reynolds number, Flow (Dynamics)
Journal Articles

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Jing He, Liping Liu, Anthony M. Jacobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
https://doi.org/10.1115/1.4005299
Published Online: November 17, 2011
View Article titled, Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel
Open the PDF for Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel in another window
Topics: Convection, Emissivity, Heat, Radiation (Physics), Temperature, Thermal analysis, Thermal conductivity, Heat transfer, Heat conduction, Flow (Dynamics)
Journal Articles

Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel

Damena D. Agonafer, J. Yeom, M. A. Shannon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031011.
https://doi.org/10.1115/1.4004217
Published Online: September 26, 2011
View Article titled, Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel
Open the PDF for Three-Dimensional CFD Model of Pressure Drop in µTAS Devices in a Microchannel in another window
Topics: Computational fluid dynamics, Flow (Dynamics), Microchannels, Pressure drop, Drag (Fluid dynamics), Heat transfer, Reynolds number
Journal Articles

Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation

Patrick A. Walsh, Edmond J. Walsh, Ronan Grimes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021001.
https://doi.org/10.1115/1.4001590
Published Online: May 19, 2010
View Article titled, Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation
Open the PDF for Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation in another window
Topics: Blades, Chords (Trusses), Fans, Flow (Dynamics), Pressure, Scaling laws (Mathematical physics), Cooling, Reynolds number, Design
Journal Articles

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

Giulio Lorenzini, Simone Moretti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
https://doi.org/10.1115/1.3144152
Published Online: July 31, 2009
View Article titled, Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules
Open the PDF for Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules in another window
Topics: Fins, Heat, Heat exchangers, Pressure, Shapes, Temperature, Thermal conductivity, Ducts, Reynolds number, Optimization
Journal Articles

Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity

Esam M. Alawadhi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011011.
https://doi.org/10.1115/1.3068322
Published Online: February 13, 2009
View Article titled, Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity
Open the PDF for Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity in another window
Topics: Flow (Dynamics), Heat, Pressure drop, Reynolds number, Temperature, Thermal management, Transients (Dynamics), Steady state, Cycles, Finite element methods
Journal Articles

A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet

Z. Q. Lou, C. Yap, A. S. Mujumdar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2008, 130(3): 034501.
https://doi.org/10.1115/1.2809447
Published Online: August 8, 2008
View Article titled, A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet
Open the PDF for A Numerical Study of a Heat Sink Fin Under a Laminar Impinging Jet in another window
Topics: Heat sinks, Heat transfer, Pressure drop, Reynolds number, Thermal resistance, Fluids, Fins
Journal Articles

Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat Sink

Abel Siu-Ho, Weilin Qu, Frank Pfefferkorn
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 479–487.
https://doi.org/10.1115/1.2804099
Published Online: May 14, 2007
View Article titled, Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat Sink
Open the PDF for Experimental Study of Pressure Drop and Heat Transfer in a Single-Phase Micropin-Fin Heat Sink in another window
Topics: Flow (Dynamics), Friction, Heat sinks, Heat transfer, Pressure drop, Reynolds number, Water, Fins, Temperature, Heat flux
Journal Articles

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Y. C. Lee, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
https://doi.org/10.1115/1.2804089
Published Online: January 25, 2007
View Article titled, Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
Open the PDF for Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement in another window
Topics: Design, Disks, Heat transfer, Multi-chip modules, Nozzles, Optimization, Reynolds number, Sensitivity analysis
Journal Articles

Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement

C. J. Fang, M. C. Wu, Y. M. Kuo, C. Y. Lee, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 400–410.
https://doi.org/10.1115/1.2804087
Published Online: December 28, 2006
View Article titled, Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement
Open the PDF for Heat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement in another window
Topics: Disks, Heat transfer, Nozzles, Reynolds number, Transients (Dynamics), Turbulence, Heat flux, Steady state, Jets, Rotation