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Journal Articles

Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review

Tolga Emir, Hamza Ourabi, Mete Budakli, Mehmet Arik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2022, 144(4): 040801.
Paper No: EP-21-1129
https://doi.org/10.1115/1.4054184
Published Online: April 28, 2022
View Article titled, Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
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Topics: Boiling, Bubbles, Critical heat flux, Heat transfer, Pool boiling, Pressure, Nucleation (Physics), Fluids, Water, Heat
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041103.
Paper No: EP-21-1083
https://doi.org/10.1115/1.4051943
Published Online: August 27, 2021
View Article titled, Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
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Topics: Boiling, Cooling, Dielectric liquids, Heat, Temperature, Copper, Flat heat pipes, Pool boiling, Critical heat flux, Subcooling
Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020904.
Paper No: EP-20-1119
https://doi.org/10.1115/1.4049928
Published Online: March 5, 2021
View Article titled, Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
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Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)
Journal Articles

A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel

Zengchao Chen, Wei Li, Junye Li, Kan Zhou, Zhaozan Feng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2021, 143(1): 014501.
Paper No: EP-19-1083
https://doi.org/10.1115/1.4046755
Published Online: June 4, 2020
View Article titled, A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel
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Topics: Boiling, Flow (Dynamics), Fluids, Heat transfer, Microchannels, Subcooling, Water
Journal Articles

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

Kan Zhou, Hua Zhu, Wei Li, Junye Li, Kuang Sheng, Shuai Shao, Haiwang Li, Zhi Tao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031006.
Paper No: EP-18-1092
https://doi.org/10.1115/1.4043476
Published Online: May 17, 2019
View Article titled, Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Subcooling, Temperature, Heat flux, Bubbles, Nucleate boiling, Flux (Metallurgy)
Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
https://doi.org/10.1115/1.4039264
Published Online: May 11, 2018
View Article titled, Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
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Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels
Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
https://doi.org/10.1115/1.4039091
Published Online: March 2, 2018
View Article titled, Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics
Journal Articles

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

C. Falsetti, M. Magnini, J. R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031008.
Paper No: EP-17-1023
https://doi.org/10.1115/1.4037152
Published Online: July 10, 2017
View Article titled, Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator
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Topics: Boiling, Flow (Dynamics), Heat flux, Heat transfer, Heat transfer coefficients, Pressure drop, Temperature, Vapors, Fins, Heat
Journal Articles

Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization

Houxue Huang, Navid Borhani, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031004.
Paper No: EP-16-1037
https://doi.org/10.1115/1.4033487
Published Online: May 17, 2016
View Article titled, Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization
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Topics: Boiling, Flow (Dynamics), Fluids, Heat, Heat flux, Microchannels, Stress, Temperature, Transients (Dynamics), Subcooling
Journal Articles

Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric Vehicles

Weihuan Zhao, David M. France, Wenhua Yu, Dileep Singh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031013.
Paper No: EP-14-1090
https://doi.org/10.1115/1.4030896
Published Online: September 1, 2015
View Article titled, Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric Vehicles
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Topics: Boiling, Coolants, Cooling, Electronics, Subcooling, Temperature, Heat flux
Journal Articles

Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks

Jaeseon Lee, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031008.
https://doi.org/10.1115/1.3144146
Published Online: July 2, 2009
View Article titled, Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks
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Topics: Boiling, Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Subcooling, Temperature, Two-phase flow
Journal Articles

A Vapotron Effect Application for Electronic Equipment Cooling

Giulio Lorenzini, Cesare Biserni
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 475–479.
https://doi.org/10.1115/1.1615796
Published Online: December 15, 2003
View Article titled, A Vapotron Effect Application for Electronic Equipment Cooling
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Topics: Boiling, Cavities, Cooling, Electronic equipment, Fluids, Forced convection, Heat transfer coefficients, Heating, Refrigerants, Temperature
Journal Articles

Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator

Y. H. Yan, J. M. Ochterbeck
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 251–260.
https://doi.org/10.1115/1.1569509
Published Online: June 10, 2003
View Article titled, Numerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator
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Topics: Boundary-value problems, Flow (Dynamics), Fluids, Heat, Heat flux, Porous materials, Pressure, Steady state, Subcooling, Temperature
Journal Articles

Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

Wataru Nakayama, Masud Behnia, Hiroaki Mishima
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 132–137.
https://doi.org/10.1115/1.483145
Published Online: February 18, 2000
View Article titled, Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array
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Topics: Boiling, Coolants, Critical heat flux, Flow (Dynamics), Forced convection, Heat transfer, Strips, Subcooling, Temperature, Nozzles
Journal Articles

Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package

A. A. Watwe, A. Bar-Cohen, A. McNeil
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 95–105.
https://doi.org/10.1115/1.2792226
Published Online: June 1, 1997
View Article titled, Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package
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Topics: Pool boiling, Pressure, Subcooling, Critical heat flux, Boiling, Nucleate pool boiling
Journal Articles

An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module

Murray E. Johns, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 264–270.
https://doi.org/10.1115/1.2792162
Published Online: December 1, 1996
View Article titled, An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module
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Topics: Accounting, Boiling, Cooling, Critical heat flux, Databases, Errors, Flow (Dynamics), Fluids, Heat, Heat transfer
Journal Articles

Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays

Kurt A. Estes, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 323–332.
https://doi.org/10.1115/1.2792112
Published Online: December 1, 1995
View Article titled, Comparison of Two-Phase Electronic Cooling Using Free Jets and Sprays
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Topics: Computer cooling, Jets, Sprays, Cooling, Critical heat flux, Subcooling, Flow (Dynamics), Liquid films, Boiling, Coolants
Journal Articles

Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints

Morris B. Bowers, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1994, 116(4): 290–297.
https://doi.org/10.1115/1.2905700
Published Online: December 1, 1994
View Article titled, Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints
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Topics: Computer cooling, Design, Heat sinks, Microchannels, Thermal diffusion, Flow (Dynamics), Heat flux, Boiling, Cooling, Critical heat flux
Journal Articles

A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics

Peter E. Jimenez, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 220–229.
https://doi.org/10.1115/1.2905689
Published Online: September 1, 1994
View Article titled, A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics
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Topics: Aircraft, Avionics, Coolants, Flow (Dynamics), Pressure drop, Subcooling, Cooling, Heat, Military systems, Printed circuit boards