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Journal Articles

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Y. W. Wang, M. Y. Tsai, Y. S. Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031001.
Paper No: EP-23-1070
https://doi.org/10.1115/1.4064354
Published Online: January 8, 2024
View Article titled, Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges
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Topics: Finite element methods, Flip-chip packages, Gages, Strain gages, Warping
Journal Articles

A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage

Chongyang Cai, Huayan Wang, Junbo Yang, Pengcheng Yin, S. B Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021006.
Paper No: EP-23-1060
https://doi.org/10.1115/1.4063919
Published Online: November 23, 2023
View Article titled, A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
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Topics: Stress, Warping, Temperature, Silicon
Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021106.
Paper No: EP-21-1010
https://doi.org/10.1115/1.4052070
Published Online: October 6, 2021
View Article titled, Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications
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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping
Journal Articles

A Hybrid Antenna in Package Solution Using FOWLP Technology

Xuesong Zhang, Qian Wang, Bo Wang, Gang Wang, Xin Gu, Yu Chen, Lin Tan, Shengjuan Zhou, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031005.
Paper No: EP-21-1024
https://doi.org/10.1115/1.4051379
Published Online: September 15, 2021
View Article titled, A Hybrid Antenna in Package Solution Using FOWLP Technology
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Topics: Design, Manufacturing, Millimeter waves, Semiconductor wafers, Warping, Waveguides, Solders, Temperature, Molding
Journal Articles

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

Chang-Chun Lee, Kuo-Shu Kao, Hou-Chun Liu, Chia-Ping Hsieh, Tao-Chih Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011001.
Paper No: EP-20-1071
https://doi.org/10.1115/1.4050198
Published Online: August 6, 2021
View Article titled, Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging
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Topics: Creep, Fatigue, Packaging, Reliability, Solder joints, Warping, Finite element analysis, Stress, Solders, Silicon
Journal Articles

Investigation of Strip Warpage Behavior in Wire Bonding Process

Wan-Chun Chuang, Wei-Long Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021002.
Paper No: EP-19-1067
https://doi.org/10.1115/1.4045362
Published Online: February 3, 2020
View Article titled, Investigation of Strip Warpage Behavior in Wire Bonding Process
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Topics: Strips, Temperature, Warping, Molding, Assembly lines
Journal Articles

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011004.
Paper No: EP-19-1023
https://doi.org/10.1115/1.4044625
Published Online: September 19, 2019
View Article titled, Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging
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Topics: Semiconductor wafers, Shrinkage (Materials), Temperature, Warping, Molding, Manufacturing, Epoxy resins, Packaging, Epoxy adhesives
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011001.
Paper No: EP-19-1028
https://doi.org/10.1115/1.4043704
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development
Open the PDF for Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development in another window
Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
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Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints
Journal Articles

Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040801.
Paper No: EP-18-1088
https://doi.org/10.1115/1.4043341
Published Online: May 17, 2019
View Article titled, Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging
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Topics: Packaging, Semiconductor wafers, Solders, Warping, Etching
Journal Articles

Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components

Qiming Zhang, Jeffery C. C. Lo, S. W. Ricky Lee, Wei Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041005.
Paper No: EP-17-1072
https://doi.org/10.1115/1.4041064
Published Online: September 10, 2018
View Article titled, Correlation of Warpage Distribution With the Material Property Scattering for Warpage Range Prediction of PBGA Components
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Topics: Ball-Grid-Array packaging, Electromagnetic scattering, Materials properties, Radiation scattering, Scattering (Physics), Temperature, Thermal expansion, Warping, Simulation, Laminates
Journal Articles

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010906.
Paper No: EP-15-1094
https://doi.org/10.1115/1.4032493
Published Online: March 10, 2016
View Article titled, Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
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Topics: Gaskets, Geometry, Heat, Manifolds, Reliability, Silicon, Stress, Topology, Vehicles, Warping
Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031006.
Paper No: EP-14-1030
https://doi.org/10.1115/1.4030065
Published Online: September 1, 2015
View Article titled, Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics
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Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics
Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031007.
Paper No: EP-13-1074
https://doi.org/10.1115/1.4027425
Published Online: May 12, 2014
View Article titled, Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods
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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision
Journal Articles

Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps

Chang-Chun Lee, Po Ting Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031006.
Paper No: EP-13-1123
https://doi.org/10.1115/1.4026854
Published Online: May 5, 2014
View Article titled, Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps
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Topics: Bonding, Design, Packaging, Reliability, Warping, Compression, Finite element analysis
Journal Articles

Hygromechanical Analysis of Liquid Crystal Display Panels

Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041005.
Paper No: EP-10-1084
https://doi.org/10.1115/1.4025527
Published Online: November 5, 2013
View Article titled, Hygromechanical Analysis of Liquid Crystal Display Panels
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Topics: Diffusion (Physics), Liquid crystals, Polarizers (Light), Temperature, Thermomechanics, Warping, Gas laws (Thermodynamics), Materials properties
Journal Articles

Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules

Pushparajah Rajaguru, Stoyan Stoyanov, Hua Lu, Chris Bailey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021009.
Paper No: EP-12-1043
https://doi.org/10.1115/1.4024056
Published Online: April 12, 2013
View Article titled, Application of Kriging and Radial Basis Function for Reliability Optimization in Power Modules
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Topics: Aluminum, Design, Optimization, Wire, Warping, Finite element analysis, Reliability, Failure
Journal Articles

Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties

Chih-Sung Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041006.
https://doi.org/10.1115/1.4005293
Published Online: December 9, 2011
View Article titled, Different Conservation Laws Constructed on Warpage Analyses for Bimaterial Plates With Temperature-Dependent Properties
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Topics: Stress, Temperature, Warping, Thermomechanics
Journal Articles

Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models

Jamil A. Wakil, Patrick W. Dehaven, Nancy R. Klymko, Shaochen Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031001.
https://doi.org/10.1115/1.4004656
Published Online: September 14, 2011
View Article titled, Thermo-Mechanical Response of Thru-Silicon Vias Under Local Thermal Transients Using Experimentally Validated Finite Element Models
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Topics: Finite element model, Reliability, Silicon, Stress, Temperature, Thermomechanics, Transients (Dynamics), Warping, Laminates, Deformation