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Keywords: PBGA Assembly
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011009.
Paper No: EP-23-1023
Published Online: December 11, 2023
...Chao Gao; Chunyue Huang; Liang Ying A finite element simulation analysis model was developed for a plastic ball grid array (PBGA) assembly to analyze its behavior under thermal cyclic loading conditions. The stress distribution in the SAC305 solder joints at different locations within the array...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... or functional testing is performed. At this stage, it becomes difficult to determine whether the defect is due to a solder joint or the component itself. Hence controlling the open defect is very important in the PBGA assembling process. It was found that three kinds of defective modes are responsible...
