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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
Published Online: March 14, 2003
... 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology...
