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Keywords: airflow rate
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011004.
Published Online: March 19, 2012
... 2012 fan characteristic curve telecommunications cabinet perforated plate airflow rate pressure drop Thermal management of electronic systems is one of the bottlenecks in today’s electronics industry. The increase in clock speeds and miniaturization involve huge increase in heat...
