... in IC Chips Using Raman Spectroscopy ,” Proceedings of the Material Research Society Meeting , Apr., San Francisco, CA . 01 10 2007 08 09 2008 13 11 2008 atomic force microscopy integrated circuit reliability nanoelectronics nanowires phase transformations Raman...

... dispersive x-ray, atomic force microscopy, focused ion beam, and an Intellectest STORM series FA1500 shear tester were used as analytical tools in this study. The results suggest that the first zincation process follows the contour of the initial bond pad. The second zincation produces a slightly better...

... cleaning annealing surface roughness thermal expansion atomic force microscopy Wafer direct bonding (WDB) is a technique for bonding clean and mirror-polished wafers without glue 1 2 . When the bonded wafers are annealed at high temperatures, relatively weak room-temperature-bonding (bonded...

... displacement measurement atomic force microscopy integrated circuit reliability nondestructive testing correlation methods flip-chip devices image processing crack detection Quality and suitability of thermo-mechanical design and optimization of advanced electronic packages by means of finite...

... atomic force microscopy surface chemistry X-ray photoelectron spectra integrated circuit technology As polymer dielectric materials appear to be the immediate successor to oxide interlevel dielectrics (ILDs), industry and academia have begun to consider the chemical-mechanical planarization...