...Wei Tong; Alireza Ganjali; Omidreza Ghaffari; Chady al Sayed; Luc Fréchette; Julien Sylvestre In a two-phase immersion cooling system, boiling on the spreader surface has been experimentally found to be nonuniform, and it is highly related to the surface temperature and the heat transfer...

...Houxue Huang; Navid Borhani; John Richard Thome Multi-microchannel evaporators with flow boiling, used for cooling high heat flux devices, usually experience transient heat loads in practical applications. These transient processes may cause failure of devices due to a thermal excursion or poor...

...Tannaz Harirchian; Suresh V. Garimella Flow boiling in microchannels has been investigated extensively over the past decade for electronics cooling applications; however, the implementation of microchannel heat sinks operating in the two-phase regime in practical applications has lagged due...

...Michel Speetjens Pool-boiling serves as the physical model problem for electronics cooling by means of phase-change heat-transfer. The key for optimal and reliable cooling capacity is better understanding of the conditions that determine the critical heat-flux (CHF). Exceeding CHF results...

... immersion cooling with fluorocarbons have shown the effectiveness of boiling enhancement structures in lowering boiling incipience, raising the critical heat flux, and reducing evaporator size. Two-phase thermosyphons are an alternative to liquid immersion cooling, where phase change liquid cooling can...

...Tailian Chen; Suresh V. Garimella The effects of dissolved air in the dielectric liquid FC-77 on flow boiling in a microchannel heat sink containing ten parallel channels, each 500 μ m wide and 2.5 mm deep, were experimentally investigated. Experiments were conducted before and after degassing...

... never observed. A flow pattern map was constructed and compared with previous maps and predictions of flow pattern transition models. Features unique to two-phase micro-channel flow were identified and employed to validate key assumptions of an annular flow boiling model that was previously developed...

... was correlated well as a function of the static pressure difference between the two vertical tubes. All chips showed the boiling curve similar to that for pool boiling except that the critical heat flux was lower for the natural circulation loop. For all chips tested, the maximum allowable heat flux q max...

...Weilin Qu, Graduate Research Assistant, Student Mem. ASME; Issam Mudawar, Professor, Fellow ASME The design and reliable operation of a two-phase micro-channel heat sink require a fundamental understanding of the complex transport phenomena associated with convective boiling in small, parallel...

... performance. The boiling was found to be surface tension dominated, and a simple model based on heat transfer from the outer surface is proposed. As much as 149 W were dissipated from a 1 cm 2 heated area. 13 11 2003 01 06 2004 A parametric investigation of performance was performed...

...Giulio Lorenzini; Cesare Biserni This research is aimed at investigating by experimental means a possible use of the Vapotron Effect for the cooling of electronic devices. The problem deals with a particular kind of subcooled boiling which is able to enhance heat exchange between a non-isothermal...

... to, pool boiling thermosyphons because of the former’s ability to separate the path of replenishment liquid from that of the released vapor. Experiments were performed to explore the effects of boiler gap (separation distance between the boiling surface and opposite insulating wall) on cooling performance...

... heat transfer and pressure drop. In general it is found that high-pressure fluids will give better performance and more compact designs as high-pressure results in higher boiling heat transfer coefficients and smaller necessary tube diameter. Apart from the properties related to the performance...

... November 1998 18 Feb 2000 organic compounds cooling thermal management (packaging) jets boiling foils heating elements forced convection dielectric liquids Immersion cooling of integrated circuit chips by dielectric coolant received considerable interest in the 1970s and 1980s...