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Keywords: computer centres
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... strategies in data centers. Finally, the impact of heat sink thermal resistance is considered, and the potential data center efficiency gains from improved heat sink designs are discussed. 07 04 2011 09 05 2011 21 09 2011 21 09 2011 computer centres cooling fans heat sinks...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031005.
Published Online: September 14, 2011
... 14 09 2011 computer centres energy conservation power aware computing The continuous growth of information technology has led to an increasing focus on the environmental impact of information technology (IT). For example, a recent study estimated that data centers in 2006 consumed...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011007.
Published Online: March 9, 2011
... floor to minimize the leakage flow through the perimeter ( 7 ). 13 10 2009 02 12 2010 09 03 2011 09 03 2011 computational fluid dynamics computer centres cooling electric conduits thermal management (packaging) Figure 1 demonstrates air flow patterns...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031006.
Published Online: September 9, 2010
... as the average of the observations. (b) POD modes, ψ i , calculation. Using the observation and solving an eigenvalue problem ( 43 ), POD modes for the entire domain are calculated. 23 12 2009 24 02 2010 09 09 2010 air conditioning computer centres cooling power...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021009.
Published Online: June 25, 2010
...–12. 13 08 2008 20 05 2010 25 06 2010 25 06 2010 computational fluid dynamics computer centres cooling mainframes parallel machines performance evaluation thermal analysis data center CFD cooling high density racks high performance computing thermal...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021002.
Published Online: May 20, 2010
... of up to 135% for the facility with 56% open tiles while the average and maximum changes for the facility with 25% open tiles are 6% and 60%, respectively. 21 04 2009 17 02 2010 20 05 2010 20 05 2010 air conditioning computer centres numerical analysis data center...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021009.
Published Online: April 2, 2009
... to consume the highest amount of energy for a given cooling function performed, with the CRAC unit being the second most inefficient component. 30 06 2008 10 12 2008 02 04 2009 air conditioning computer centres cooling heat transfer mechanical engineering computing...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041104.
Published Online: November 13, 2008
... thermal solution for the next generation data centers. In Sec. 3C , the problems in realization of an ideal open multiscale solution in data centers are discussed. air conditioning computer centres To understand the difficulties of design and application of an open solution for data...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 380–387.
Published Online: January 5, 2006
... mm ( 0.5 ft ) . Following is the parametric study of each design variable over the defined range ( 4 ). As each parameter was investigated, the other two parameters were fixed at the baseline value. 24 05 2005 05 01 2006 computer centres cooling data...
Journal Articles
Timothy D. Boucher, David M. Auslander, Cullen E. Bash, Clifford C. Federspiel, Chandrakant D. Patel
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 137–144.
Published Online: November 11, 2005
... upon
the fluid movement and pressure distribution above the floor). 12 11 2004 11 11 2005 data center cooling smart cooling dynamic thermal control energy optimization thermal management computer centres air conditioning cooling environmental factors...