1-3 of 3
Keywords: dielectric materials
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 276–285.
Published Online: August 12, 2004
... integrated circuit modelling integrated circuit reliability integrated circuit testing finite element analysis indentation viscoelasticity dielectric materials polymer films thin film circuits 21 06 2004 12 08 2004 Nanoindentation experiments were carried out on a SiLK film...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 202–207.
Published Online: July 8, 2004
... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon Flip chip bonding technology using anisotropic conductive films (ACFs) has been used for decades in the area LCD display applications. In recent, there has been growing interest in using...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 28–33.
Published Online: October 20, 1999
... materials polymers adhesion thermal stability packaging reliability Polymer dielectric materials such as polyimide and benzocyclobutene (BCB) have been in use as thin film coatings for various electronic packaging applications, such as chip scale packaging/bumping/redistribution 1 2 3...