... integrated circuit modelling integrated circuit reliability integrated circuit testing finite element analysis indentation viscoelasticity dielectric materials polymer films thin film circuits 21 06 2004 12 08 2004 Nanoindentation experiments were carried out on a SiLK film...

... devices polymers dielectric materials fracture delamination thermal stress cracking aluminium silicon Flip chip bonding technology using anisotropic conductive films (ACFs) has been used for decades in the area LCD display applications. In recent, there has been growing interest in using...

... materials polymers adhesion thermal stability packaging reliability Polymer dielectric materials such as polyimide and benzocyclobutene (BCB) have been in use as thin film coatings for various electronic packaging applications, such as chip scale packaging/bumping/redistribution 1 2 3...