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1-4 of 4
Keywords: finite volume method
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Journal Articles
Zuraihana Bachok, Mohamad Aizat Abas, Muhammad Zaim Hanif Nazarudin, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041018.
Paper No: EP-21-1157
Published Online: April 22, 2022
... joint reliability. However, it is difficult to accurately measure the effect of solder volume during the laser soldering process. The finite volume method (FVM) is used to simulate the molten solder flow in laser soldering to connect the through-hole capacitor onto the PCB in ansys fluent software...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041006.
Paper No: EP-21-1075
Published Online: November 22, 2021
... soldering process has been developed to meet these demands. This article investigates the effect of different temperature of laser soldering process on lead-free solder (SAC305) by means of numerical method that is validated by experiment. Finite volume method (FVM) was used for the three-dimensional...
Journal Articles
Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031005.
Paper No: EP-20-1106
Published Online: January 19, 2021
... time production since it integrates the simultaneous reflow and cure of the solder interconnect and underfill. This paper investigates the effect of different dispense patterns of no-flow underfill process by mean of numerical and experimental method. Finite volume method (FVM) was used for the three...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011003.
Published Online: March 19, 2012
...C. Y. Khor; M. Z. Abdullah; M. Abdul Mujeebu In this paper, the finite volume method (FVM) is used for the simulation of flip chip underfill process by considering non-Newtonian flow between two parallel plates that emulate the silicon die and the substrate. 3D model of two parallel plates of size...
