.... In the selection of the epoxy potting material and the reliability assessments of the supplemental restraint systems, fracture parameters such as steady-state strain energy release rate stress and fracture toughness are critical. Rectangular beam specimens of the epoxy/PCB interface are fabricated for different...

.... However, the measurement of Δ σ in Eq. (25) poses a significant challenge by experiments, thereby hindering the direct application of the Blech Effect criterion. The proposed electromigration fracture toughness is more applicable because all the parameters can be measured by experiments...

...A. Polyakov; M. Bartek; J. N. Burghartz This paper reports on an area-selective adhesive wafer bonding, using photosensitive BCB from Dow Co. The strength of the fabricated bonds is characterized using the wedge-opening and tensile methods. The measured fracture toughness is 53.5 ± 3.9 J / m 2...

... induced stresses, or process-induced intrinsic stresses or a combination of these different loads. In order to design against delamination, knowledge of the interfacial fracture toughness of the Ti/Si interface is necessary. However, interfacial fracture toughness data for such interfaces is not widely...

.... 01 March 2003 30 04 2004 silicon elemental semiconductors surface roughness surface morphology fracture toughness polishing sputter etching grinding In recent years, the rapid market growth in portable and hand-held products challenges the electronic packaging industry...

.... The cleavage planes with the lowest fracture toughness in silicon are the {111} planes where K Ic = 0.82 MPA m , but the fracture toughness is not that much greater on the {001} planes where K Ic = 0.90 MPa m 4 . The surfaces of silicon wafers are {001} planes so...

... this uncertainty. 04 December 2000 01 May 2002 12 12 2002 plastic packaging integrated circuit packaging fracture mechanics integrated circuit reliability failure analysis delamination thermal stress cracking finite element analysis fracture toughness Microelectronic...

...Shoji Kamiya; Hironori Takahashi; Masumi Saka; Hiroyuki Abe´ CVD diamond particles were produced on silicon substrates under various conditions such as different methane concentration in the source gas mixture and the substrate temperature. Adhesive fracture toughness of these diamond particles...

... with respect to the acceleration of the onset of package delamination. In this paper the effect of moisture on the interfacial fracture toughness of two no-flow underfill materials with a commercially available solder mask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated...

... for impending crack branching is (4) G R = G ic G pc . The point for crack kinking into the adhesive can then be determined from ( 4 ) once the quantities on both sides of ( 4 ) are determined. Let the fracture toughness of the interface be G ic...