... on the chip. Four distinct image processing algorithms are evaluated and compared in terms of speed, accuracy, and occurrence of false positives and negatives. The impact of background thermal activity and finite duration of Trojan activity on the accuracy of detection is investigated. Within the parameter...

... displacement measurement atomic force microscopy integrated circuit reliability nondestructive testing correlation methods flip-chip devices image processing crack detection Quality and suitability of thermo-mechanical design and optimization of advanced electronic packages by means of finite...

... measurement thermal stresses thermal expansion integrated circuit reliability image processing 31 May 2001 26 07 2002 Contributed by the Electronic and Photonic Packaging Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS . Manuscript received by the EPPD May 31, 2001...