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Keywords: impact (mechanical)
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
Published Online: November 17, 2008
... from 3D DIC are compared with the accelerations recorded by the accelerometers mounted on board. 06 02 2007 11 01 2008 17 11 2008 accelerometers electronic engineering computing impact (mechanical) printed circuit testing printed circuits strain gauges transient...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 170–177.
Published Online: July 26, 2002
... be idealized as an elongated rectangular simply supported plate is used to illustrate the suggested concept. dynamic testing life testing dynamic response integrated circuit packaging optoelectronic devices impact (mechanical) bending 2002 ASME ...