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Journal Articles

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Reece Whitt, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041104.
Paper No: EP-24-1025
https://doi.org/10.1115/1.4065944
Published Online: July 25, 2024
... the reliability increase as a result of maintaining constant junction temperatures with the active jet impingement scheme. e-mail:  dhuitin@uark.edu 31 01 2024 10 06 2024 25 07 2024 Unsteady jet impingement variable area iris junction temperature Strouhal...
View Article titled, Variable Area Jet Impingement for Enhanced <span class="search-highlight">Junction</span> <span class="search-highlight">Temperature</span> Control of High-Power Electronics
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Topics: Electronics, Flow (Dynamics), Heat transfer, Junctions, Nozzles, Temperature, Temperature control, Testing, Transients (Dynamics), Actuators
Journal Articles

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
https://doi.org/10.1115/1.3103947
Published Online: April 2, 2009
...Yutaka Kumano; Tetsuyoshi Ogura; Toru Yamada A novel computational fluid dynamics analysis method of predicting semiconductor junction temperatures precisely without modeling printed circuit board (PCB) line patterns was developed. First, PCBs are divided into multiple regions. The effective...
View Article titled, High-Accuracy Thermal Analysis Methodology for Semiconductor <span class="search-highlight">Junction</span> <span class="search-highlight">Temperatures</span> by Considering Line Patterns of Three-Dimensional Modules
Open the PDF for High-Accuracy Thermal Analysis Methodology for Semiconductor <span class="search-highlight">Junction</span> <span class="search-highlight">Temperatures</span> by Considering Line Patterns of Three-Dimensional Modules in another window
Topics: Computational fluid dynamics, Junctions, Semiconductors (Materials), Temperature, Thermal conductivity, Modeling, Thermal analysis, Anisotropy