... was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model. 14 09 2010 13 05 2011 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys This work of authorship was prepared as an account...

... relevance. These were measured as outlined below. ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high...

... during solder spreading Arrhenius plot for the spreading of the Sn–37Pb solder 01 02 2010 03 10 2010 19 11 2010 19 11 2010 eutectic alloys interface phenomena lead alloys silver alloys solders surface roughness tin alloys wetting zinc alloys wetting...

... had a higher modulus, lower CTE, and slightly higher T g . 17 10 2009 06 06 2010 09 09 2010 09 09 2010 adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys The move...

... vibration-induced strains are usually elastic. durability fatigue integrated circuit interconnections lead alloys solders tin alloys vibrations 29 10 2007 05 12 2008 25 02 2009 Local 2D model for resistor component L C R component on the FEA...

... . 16 06 2005 04 10 2006 solders lead alloys tin alloys plasticity eutectic alloys indentation elastic deformation plastic deformation hardness testing integrated circuit packaging Length scale, nanoindentation, strain gradient plasticity, size effects It has been...

... 63Sn–37Pb solder lead alloys materials properties mechanical testing soldering solders tin alloys work hardening 23 02 2006 20 07 2006 2007 American Society of Mechanical Engineers ...

.... 307 – 312 . fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys stress effects shear deformation creep testing tin alloys silver alloys copper alloys lead alloys fractography Many factors can affect...

... correlation to the creep deformation and that the correlation is different for lead-free and lead-containing solder alloys. 06 12 2005 21 05 2006 solders electronics packaging creep testing deformation tin alloys lead alloys silver alloys copper alloys Lead-free solder alloys...

... topography surface morphology adhesion solders scanning electron microscopy X-ray chemical analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium 03 04 2005 29 11 2005 2006 American Society of Mechanical Engineers ...

... and electrically ( 1 ). flip-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys 13 09 2004 24 11 2005 2006 American Society of Mechanical Engineers ...

... silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes An area array package (AAP) assembly consists of an integrated circuit (silicon chip) packaged...

... to the outer rim, where they accumulate and coalesce to form big voids. 29 06 2004 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering...

... shear strength creep testing ductility tin alloys lead alloys Solders have been used as a connection material between electric parts. They receive low cycle fatigue damage during on/off switching caused by the mismatch of the coefficients of thermal expansion of the parts. Since...

... printed circuit manufacture stress relaxation stress-strain relations tin alloys lead alloys silver alloys integrated circuit packaging finite element analysis creep strain rate 62%Sn–36%Pb–2%Ag alloy area array package chips CSP ball grid array printed wiring boards An area...

... Editor: D. Agonafer. 01 June 2003 01 February 2004 06 10 2004 copper transient analysis metal foams bismuth alloys tin alloys lead alloys indium alloys heat sinks thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature...

... simplifications have been used for modeling plastic and creep strains under HISS/DSC. 13 10 2003 14 09 2004 tin alloys lead alloys eutectic alloys solders electronics packaging viscoelasticity viscoplasticity Recent trends in electronic packaging underscore the need...

... ) loading angle 90 deg 01 10 2003 26 05 2004 tin alloys lead alloys silver alloys copper alloys solders ball grid arrays printed circuit testing fatigue testing deformation soldering Electronic Packaging Ball Grid Array (BGA) Solder Joints Low Cycle Fatigue...

... . 12 01 2004 18 05 2004 lead alloys silver alloys tin alloys solders flip-chip devices integrated circuit reliability microassembling integrated circuit packaging reflow soldering voids (solid) Flip-chip technology has been positioned as a key electronic packaging...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2001; final revision, October 2003. Associate Editor: Z. Suo. 01 June 2001 01 October 2003 30 04 2004 solders tin alloys lead alloys fatigue viscoplasticity creep...