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Keywords: lead bonding
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041014.
Published Online: December 9, 2010
... ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography 29 07 2009 09 08 2010 09 12...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2010, 132(4): 044501.
Published Online: December 3, 2010
... gold lead bonding tape automated bonding thin films tin In the past two decades, liquid crystal displays (LCDs) have a big market share in the industry of flat panel display (FPD), thanks to the merits of lighter, thinner, and miniaturation. COG is a common technique in the LCD packaging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
Published Online: November 19, 2010
... of ultrasonic vibrations to the bonding interface ( 1 ). wire bonding bonding electrical signal feature extraction principal components analysis bond quality band-pass filters data acquisition electronics packaging feature extraction Hilbert transforms lead bonding neural nets principal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031012.
Published Online: September 30, 2010
... bonding. ( c ) Five-wire bonding. ( d ) Lead frame. Results of maximum temperature of the Si chip; LF: lead frame. 29 11 2009 08 08 2010 30 09 2010 30 09 2010 cracks fracture mechanics insulated gate bipolar transistors lead bonding power bipolar transistors...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 391–399.
Published Online: November 28, 2006
... 2006 active networks cracks electrical faults finite element analysis friction integrated circuit bonding integrated circuit manufacture lead bonding stress analysis A higher level of circuitry integration is the primary driving force for the semiconductor industry. Increasing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 192–201.
Published Online: November 23, 2005
... particles in bond pad aluminum metallization are the potential site of void nucleation. 06 09 2004 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
Published Online: January 24, 2005
.... The results indicate good agreement (∼6% discrepancy) between the numerical model and the measurement. electronics packaging thermal resistance thermal conductivity radio equipment lead bonding thermal analysis microassembling numerical analysis Projected increases in interconnect density...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 57–59.
Published Online: April 30, 2004
... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003. Associate Editor: K. Kishimoto. 01 June 2003 30 04 2004 soldering lead bonding adhesion thermomechanical treatment stress analysis The reliability of solder...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
Published Online: April 30, 2004
... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 589–596.
Published Online: December 15, 2003
... gallium arsenide power amplifiers radiofrequency amplifiers MESFET integrated circuits field effect analogue integrated circuits integrated circuit packaging high-temperature electronics lead bonding thermal resistance thermal conductivity integrated circuit modelling integrated circuit...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 549–555.
Published Online: December 15, 2003
... as an alternative in the field of GaAs heterojunction transistors. The technological and electrical advantages are reviewed in Ref. 1 . finite element analysis flip-chip devices lead bonding power bipolar transistors heterojunction bipolar transistors gold 01 November 2002 15 12 2003...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 617–620.
Published Online: December 15, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2003. Associate Editor: E. Suhir. 01 February 2003 15 12 2003 gold copper aluminium integrated circuit interconnections integrated circuit packaging integrated circuit reliability ageing lead bonding hardness...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 447–455.
Published Online: September 17, 2003
... arrays plastic packaging lead bonding thermal conductivity thermal management (packaging) 2003 ASME ...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 234–239.
Published Online: July 26, 2002
... reliability chip scale packaging plastic deformation ball grid arrays flip-chip devices fatigue ductility stress-strain relations lead bonding integrated circuit interconnections finite element analysis 03 April 2001 26 07 2002 Contributed by the Electronic and Photonic Packaging...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
Published Online: July 26, 2002
... properly, could damage even traditional silicon oxide. thermal management (packaging) lead bonding integrated circuit interconnections electronic speckle pattern interferometry scanning electron microscopy flip-chip devices integrated circuit packaging displacement measurement strain...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 27–36.
Published Online: March 13, 2001
... on the numerical results. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters March 13, 2001. Associate Editor: Y. C. Lee. 13 March 2001 plastic deformation hardness lead bonding...