.... Better performance may be achieved by careful optimization of the heat sink’s geometrical parameters and by adapting a new class of hybrid cooling schemes that combine the benefits of microchannel flow with those of jet impingement. It is important to emphasize that this paper is by no means...

... microchannel flow micromechanical devices surface chemistry Micropost-filled reactors are commonly found in many micro-total analysis system applications because of their large surface area for the surrounding volume. Optimal fabrication of such devices by increasing the arrays of posts with smaller...

... that involve microchannel flows. c p specific heat at constant pressure H channel height H s substrate thickness k thermal conductivity Kn Knudsen number L channel length n the outward...

...Marta Rencz 10 03 2011 10 03 2011 cooling electronics packaging heat transfer microchannel flow Microelectronics thermal experts from four continents met in the fall of 2009 at the 15th THERMINIC Workshop in Leuven, Belgium. The event was sponsored by the IEEE Computer...

... 02 03 2011 02 03 2011 boiling cooling heat sinks microchannel flow microchannel flow boiling confinement effects microchannel dimensions flow regime map transition criteria This manuscript is based on a keynote lecture delivered at THERMINIC, Leuven, Belgium...

... 05 03 2009 02 07 2009 heat sinks microchannel flow thermodynamics two-phase flow Today, there is an urgent need for innovative thermal management solutions that can tackle the high flux heat dissipation of high-end electronic and power devices. Heat removal rates from...

.... power law fluid microchannels squeezing flow Hele-Shaw thermal interface computational fluid dynamics heat transfer microchannel flow thermal resistance 08 12 2008 15 03 2009 23 06 2009 2009 American Society of Mechanical Engineers ...

...Myung Ki Sung; Issam Mudawar This study examines the cooling performance of two hybrid cooling schemes that capitalize on the merits of both microchannel flow and jet impingement to achieve the high cooling fluxes and uniform temperatures demanded by advanced defense electronics. The jets supply...

... 07 01 2009 01 04 2009 finite volume methods heat sinks heat transfer laminar flow microchannel flow Navier-Stokes equations polynomial approximation quadratic programming response surface methodology thermal resistance trapezoidal microchannel electronic cooling...

... integration are also discussed in literature ( 4 5 6 7 ). microchannel flow thermal analysis thermal management (packaging) 07 05 2008 30 05 2008 25 02 2009 The package is assumed to be composed of two materials, with thermal conductivities of 1 and 0.1, and densities...

... and fabrication trade-offs. 26 03 2007 16 01 2008 29 07 2008 coolants cooling copper finite element analysis heat sinks laminar flow microchannel flow power electronics thermal conductivity thermal management (packaging) Power electronic circuits process electrical energy...

... response integrated circuit packaging cooling microchannel flow thermal resistance 20 12 2005 15 02 2007 2007 American Society of Mechanical Engineers ...

... for macroscale channels, can also be used to enhance heat transfer inside microchannels. laminar flow microchannel flow flow simulation heat transfer dimple microchannel heat transfer enhancement Heat transfer inside flow passages can be enhanced by using passive surface modifications...

... was reduced as a result of the presence of dissolved gas, with the enhancement in heat transfer being much less pronounced for water. heat sinks electronics packaging flow instability microchannel flow dielectric liquids bubbles heat transfer boiling 11 07 2005 01 02 2006...

... constraints. Impingement air cooling with heat sinks is one attractive solution to these problems. impingement flow heat sink thermal resistance heat transfer heat sinks electronics packaging cooling thermal resistance laminar flow microchannel flow Figure 11 shows the comparison...

.... , Launay , S. , and Lallemand , M. , 2003 , “ Angles de Contact en Milieu Saturé d’une Goutte d’Eau sur une Surface d’Oxyde de Silicium ,” SFT 2003 , Elsevier , Paris , pp. 403 – 407 . 11 10 2004 11 10 2005 heat pipes microchannel flow thermal conductivity electronics...

... measurement microchannel flow laminar flow vortices cooling pressure measurement thermal management (packaging) Figure 7 shows a similar comparison between measured and predicted velocity profiles at z ′ = 347 and 555 μ m for Re ch = 1895 at a downstream...

... in pressure drop. 07 09 2004 17 06 2005 refrigeration thermal management (packaging) integrated circuit packaging microchannel flow cooling heat sinks compressors While thermal management of high-heat-flux electronic devices has attracted significant attention in recent years...

.../j.jpowsour.2003.12.025 , 130 , pp. 178 – 191 . Shah , R. K. , and London , A. L. , 1978 , Laminar Flow Forced Convection in Ducts, Advances in Heat Transfer , Adademic , New York . computational fluid dynamics heat sinks microchannel flow thermal resistance thermal management...