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1-2 of 2
Keywords: micropumps
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025002.
Published Online: April 3, 2009
... heat fluxes up to 100 W / cm 2 in one compact and efficient package. Additionally, it has been shown that the F2/S2 design can handle these thermal loads with a relatively small pressure drop penalty, within the realm of existing micropump technologies. Finally, the feasibility of the F2/S2 design...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 527–530.
Published Online: December 15, 2003
...M. Carmona; S. Marco; J. Samitier; M. C. Acero; J. A. Plaza; J. Esteve The analysis of a thermo-pneumatic actuation unit for its use in a micropump has been carried out. Coupled thermo-mechanical simulations by finite element method (FEM) (with ANSYS software) were required because...
