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Keywords: modal testing
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 449–455.
Published Online: February 15, 2006
... by the geometrical and material properties of the bare board and by the boundary conditions supporting the loaded PCB. In this research, a PCB carrying a heavy CPU cooling fan and supported by six fastening screws is investigated by the modal testing and analyzed by the finite element method. After the finite...
