... characterization measurements above the temperature and humidity capability of typical commercial instruments. The results showed that moisture induced swelling is significant compared with thermal expansion and increases significantly with temperature above the glass transition temperature (T g ). EMCs were found...

... the overall effectiveness of the TIM. Although significant amount of work has been done on understanding the thermal and moisture effects of various polymer materials used in microelectronic package assemblies, very limited work has been done to study the effect of temperature and moisture on TIM delamination...

...B. Xie; X. J. Fan; X. Q. Shi; H. Ding Moisture concentration is discontinuous at interfaces when two materials, which have different saturated moisture concentrations, are joined together. In order to perform moisture diffusion modeling in a multimaterial system such as electronic packages...

...B. Xie; X. J. Fan; X. Q. Shi; H. Ding In the present study, the direct concentration approach (DCA) and the whole-field vapor pressure model developed in Part I of this work ( Xie et al., 2009 “Direct Concentration Approach of Moisture Diffusion and Whole Field Vapor Pressure Modeling for Reflow...

...Samson Yoon; Changsoo Jang; Bongtae Han A nonlinear finite element modeling (FEM) scheme to analyze the combined effect of thermal and hygroscopic deformation is presented. The scheme employs the conventional moisture diffusion, heat transfer, and stress analysis routines available...

...Samson Yoon; Bongtae Han; Zhaoyang Wang Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) direct analogy and (2) normalized analogy. The schemes...

...Xu Chen; Shufeng Zhao; Linda Zhai The moisture absorption experiments of two kinds of molding compound are conducted. The diffusion at low temperature and humidity observes the Fick’s Law, but it does not strictly obey at higher temperature and humidity. The phenomena can be attributed...

...Timothy Ferguson, Mem. ASME; Jianmin Qu, Fellow ASME In a previous study, we found that moisture preconditioning strongly influenced the interfacial fracture toughness of the underfill/solder mask interface, decreasing the interfacial adhesion by approximately one-half for both classifications...

.... This critical factor was measured by V-notched three-point bending tests and the displacement extrapolation method along with the three dimensional (3-D) finite element method (FEM). Moisture concentration in the QFP after absorption is analyzed, and vapor pressure caused by the solder reflow process...

...C. L. Chung; James Fan; M. L. Huang; F. J. Tsai In this paper, the study on failure mechanism of moisture sensitivity reliability is reported. It focuses on the PCT conditions which are 121°C, 2atm, 100RH%, and 168 hr. The general failure mode is delamination on the interface between die attach...

...Timothy Ferguson, Member ASME; Jianmin Qu, Fellow ASME Moisture poses a significant threat to the reliability of microelectronic assemblies and can be attributed as being the principal cause of many premature package failures. Of particular concern is characterizing the role of moisture...

... moisture conditioning was found to be significant compared to the thermal stress during solder reflow. Hygroscopic stress in over-molded wire bond PBGA and molded Flip Chip PBGA was found to be 1.3 times to 1.5 times that of thermal stress. Hygroscopic swelling of the underfill in FCPBGA was found...

...H. Fre´mont; J. Y. Dele´tage; A. Pintus; Y. Danto Plastic encapsulated devices are of great interest against their ceramic or metallic counterparts, as they permit significant cost reductions. However, they are more sensitive to moisture ingress, which can lead to reliability problems. Moisture can...

...M. Uschitsky; E. Suhir Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) is greatly affected by the compound ability to absorb moisture. Accordingly, the objective of the study is to evaluate the effect of moisture sorption on the mechanical...