1-4 of 4
Keywords: nanoelectronics
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Introduction for JEP Special Issue on Carbon Nanotubes

Tarek Ragab, Dr., Cemal Basaran, Dr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
https://doi.org/10.1115/1.4004324
Published Online: July 1, 2011
...Tarek Ragab, Dr.; Cemal Basaran, Dr. 03 04 2011 01 06 2011 01 06 2011 01 07 2011 01 07 2011 carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes...
View Article titled, Introduction for JEP Special Issue on Carbon Nanotubes
Open the PDF for Introduction for JEP Special Issue on Carbon Nanotubes in another window
Topics: Carbon nanotubes, Electronic packaging, Chirality, Electron field emission, Nanoelectronics, Strength (Materials)
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
... in IC Chips Using Raman Spectroscopy ,” Proceedings of the Material Research Society Meeting , Apr., San Francisco, CA . 01 10 2007 08 09 2008 13 11 2008 atomic force microscopy integrated circuit reliability nanoelectronics nanowires phase transformations Raman...
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
Open the PDF for Microscale and Nanoscale Thermal Characterization Techniques in another window
Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

Thermal Phenomena in Nanoscale Transistors

Eric Pop, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
https://doi.org/10.1115/1.2188950
Published Online: December 14, 2006
... nanoelectronics transistors semiconductor device packaging ballistic transport thermal analysis Thermal conductivities of a few materials used in device fabrication. Phonon boundary scattering significantly reduces the thermal conductivity of a 10 nm thin silicon film. Note that phonons...
View Article titled, Thermal Phenomena in Nanoscale Transistors
Open the PDF for Thermal Phenomena in Nanoscale Transistors in another window
Topics: Phonons, Silicon, Transistors, Heat, Nanoscale phenomena, Electrons, Nanowires
Journal Articles

Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

C. Basaran, H. Ye, D. C. Hopkins, D. Frear, J. K. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
https://doi.org/10.1115/1.1898338
Published Online: September 15, 2004
... investigated 22 12 2003 15 09 2004 power electronics nanoelectronics flip-chip devices soldering electromigration current density microassembling reliability Flip Chip Solder Joint Reliability Electromigration Thermomigration Current Stressing High Current Density Power...
View Article titled, Failure Modes of Flip Chip Solder Joints Under High Electric Current Density
Open the PDF for Failure Modes of Flip Chip Solder Joints Under High Electric Current Density in another window
Topics: Current density, Electrodiffusion, Failure, Flip-chip, Flip-chip devices, Solder joints, Failure mechanisms, Nucleation (Physics)