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Keywords: nanoelectronics
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Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
Published Online: July 1, 2011
...Tarek Ragab, Dr.; Cemal Basaran, Dr. 03 04 2011 01 06 2011 01 06 2011 01 07 2011 01 07 2011 carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes...
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
Published Online: November 13, 2008
... in IC Chips Using Raman Spectroscopy ,” Proceedings of the Material Research Society Meeting , Apr., San Francisco, CA . 01 10 2007 08 09 2008 13 11 2008 atomic force microscopy integrated circuit reliability nanoelectronics nanowires phase transformations Raman...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
Published Online: December 14, 2006
... nanoelectronics transistors semiconductor device packaging ballistic transport thermal analysis Thermal conductivities of a few materials used in device fabrication. Phonon boundary scattering significantly reduces the thermal conductivity of a 10 nm thin silicon film. Note that phonons...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
... investigated 22 12 2003 15 09 2004 power electronics nanoelectronics flip-chip devices soldering electromigration current density microassembling reliability Flip Chip Solder Joint Reliability Electromigration Thermomigration Current Stressing High Current Density Power...