... online May 12, 2014. Assoc. Editor: Masaru Ishizuka. 20 10 2013 06 04 2014 In this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180 deg bends. The total thermal...

... behaviors for the variable-fin-density configurations help to homogenize the temperature distribution, which is a desired feature for the thermal management of 3D ICs. The objective of analyzing these designs is to find a balanced configuration in terms of heat transfer and pressure drop. The effect...

... pumping power is calculated by (10) P = V · Δ p where V is the volumetric flow rate in a heat sink, Δ p is the pressure drop across the channel. The commercial software fluent was applied to solve the governing equations with appropriate boundary conditions. The pressure...

... 2012 fan characteristic curve telecommunications cabinet perforated plate airflow rate pressure drop Thermal management of electronic systems is one of the bottlenecks in today’s electronics industry. The increase in clock speeds and miniaturization involve huge increase in heat...

...Zhipeng Duan; Y. S. Muzychka The performance of impingement air cooled plate fin heat sinks differs significantly from that of parallel flow plate fin heat sinks. A simple impingement flow pressure drop model based on developing laminar flow in rectangular channels is proposed. The model...