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Keywords: thermal interface material
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
Published Online: March 8, 2022
... density thermal interface material National Natural Science Foundation of China 10.13039/501100001809 51975594 National Natural Science Foundation of China 10.13039/501100001809 U20A6004 With the improvement of the integration degree of the package structure, the microbumps...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
Published Online: September 15, 2021
.... The improvement of flip chip reliability by using thermal interface materials was studied. First, a three-dimensional finite element model of the flip chip packaging system and the finite element simulation of electric-thermal-force multifield coupling were conducted. Then, the Joule heating, temperature...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031114.
Paper No: EP-19-1110
Published Online: June 8, 2020
... operation temperature. The pluggable nature of the modules requires dry contact thermal interfaces that permit repeated insertion–disconnect cycles under low compression pressures (∼10 to 100 kPa). Conventional wet thermal interface materials (TIM), such as greases, or those that require high compression...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011001.
Paper No: EP-13-1112
Published Online: March 10, 2016
...S. Shanmugan; O. Zeng Yin; P. Anithambigai; D. Mutharasu All solid-state lighting products produce heat which should be removed by use of a heat sink. Since the two mating surfaces of light emitting diode (LED) package and heat sink are not flat, a thermal interface material (TIM) must be applied...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034502.
Paper No: EP-13-1099
Published Online: May 12, 2014
... are at 0.1 ms, 0.5 ms, 2 ms, and 8 ms with ±3–4% of deviation. Heights of the peaks have no significance in this test. References [1] de Sorgo , M. , 1996 , “ Thermal Interface Materials ,” Electron. Cool. , 2 , pp. 12 – 15 . [2] Petroski , J. , 2002 , “ Thermal Challenges Facing New...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011012.
Paper No: EP-13-1045
Published Online: February 18, 2014
... the thermal resistance of Sn-Bi solder paste used as thermal interface material (TIM) by laser flash technique, and a thermal resistance less than 5 mm 2 K/W was achieved for the Sn-Bi TIM. The Sn-Bi solder also showed a good reliability in terms of thermal resistance after thermal cycling, indicating...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011009.
Paper No: EP-13-1088
Published Online: January 24, 2014
...; published online January 24, 2014. Assoc. Editor: Masaru Ishizuka. 15 08 2013 25 12 2013 Thermal grease, as a thermal interface material (TIM), has been extensively applied in electronic packaging areas. Generally, thermal greases consist of highly thermally conductive solid fillers...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
Published Online: June 11, 2010
...Xi Liu; Jiantao Zheng; Suresh K. Sitaraman The thermal efficacy of thermal interface material (TIM) is highly dependent on its ability to adhere to the surfaces of interest. Any delamination of the TIM from the die or the lid will increase the local thermal resistance and, thus, will reduce...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 46–52.
Published Online: September 23, 2005
...Jong-Jin Park; Minoru Taya A thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and chloroform. The thermal impedance of the TIM was measured using a new device based...