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Keywords: thin flexible substrates
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 236–245.
Published Online: November 24, 2005
.... The focus is to apply thin silicon stacking methods using thin flexible substrate interconnect and in particular to investigate the behavior of the selected materials. Both commercial and in-house polyimide substrates, in the thickness range 25 μ m down to 3 μ m (each with 4 μ m of sputtered copper) were...