... of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network...

...K. N. Prabhu; G. Kumar The effects of substrate material, substrate surface roughness, and operating temperature on the wetting behavior of Sn–37Pb, Sn–3.5Ag, and Sn–9Zn eutectic solders on metallic substrates were investigated. Solder spreading kinetics was successfully represented...

... resins self-assembly joining processes surface tension electronics packaging numerical analysis wetting 3 Mathematical models of an axisymmetric liquid joint for ( a ) the put-down model and ( b ) the pull-up model 1 The chip weight per bump, the liquid volume, and the pad...

... and reflow. The final shape of the solder joint is a function of surface tension, wetting area, gravity, and applied forces. In this paper, a new methodology to simulate solder joint shape is presented. Large deformation viscoplastic finite element analysis is used to simulate incompressible fluid flow...

... the process, a 3D model is formed. Then it is numerically simulated using Surface Evolver program. Based on the results, the solder bridging mechanism and the effective factors including wetting angle and surface tension are investigated. Gao , Y. X. , Fan , H. , and Xiao , Z. , 2000...

...L. L. Meekisho, Mem. ASME,; K. Nelson-Owusu, Mem. ASME, The final shape of a solidified solder fillet joint from a reflow process is determined by process parameters and the solder alloy’s physical properties, including surface tension, density, gravity, and wetting angles. This work investigates...

... 14 03 2003 plastic packaging assembling circuit reliability failure analysis ball grid arrays surface mount technology reflow soldering printed circuit manufacture wetting thermal stability inspection Defect PBGA Assembly Soldering Profile Surface Mount Technology...

...D. Josell; W. E. Wallace; J. A. Warren; D. Wheeler; A. C. Powell, IV The results of wetting experiments between eutectic lead-tin solder and copper pads on silicon substrates in geometries relevant to flip-chip applications are presented. Measurements of solder joint dimensions, specifically stand...