Small scale, thermally driven power sources will require appropriate insulation to achieve sufficiently high thermal conversion efficiencies. This paper presents a micro-insulation design, which was developed for a thermionic microbattery, which converts the decay heat from radioactive isotopes directly to electricity using a vacuum thermionic diode. The insulation concept, which is suitable for any small scale application, separates two planar surfaces with thin, semicircular posts, thus reducing conduction heat transfer and increasing the relative radiation heat transfer. In this case, the surfaces are silicon wafers and the columns are SU-8, a photoresist material. The experimental results indicate that this design is adequate for a practical power source concept, and they are supported by a numerical model for the effective thermal conductivity of the structure. The results show that a typical design of with a diameter and a wall thickness has an apparent thermal conductivity on the order of at a pressure of 1 Pa. System models of a thermionic power source indicate that this is sufficiently low to provide practical efficiency.
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Research Papers
A Micro-Insulation Concept for MEMS Applications
Rui Yao,
Rui Yao
Department of Engineering Physics,
University of Wisconsin-Madison
, 1500 Engineering Drive, Madison, WI 53706
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James Blanchard
James Blanchard
Department of Engineering Physics,
e-mail: blanchard@engr.wisc.edu
University of Wisconsin-Madison
, 1500 Engineering Drive, Madison, WI 53706
Search for other works by this author on:
Rui Yao
Department of Engineering Physics,
University of Wisconsin-Madison
, 1500 Engineering Drive, Madison, WI 53706
James Blanchard
Department of Engineering Physics,
University of Wisconsin-Madison
, 1500 Engineering Drive, Madison, WI 53706e-mail: blanchard@engr.wisc.edu
J. Heat Transfer. May 2009, 131(5): 052401 (7 pages)
Published Online: March 16, 2009
Article history
Received:
August 24, 2007
Revised:
November 18, 2008
Published:
March 16, 2009
Citation
Yao, R., and Blanchard, J. (March 16, 2009). "A Micro-Insulation Concept for MEMS Applications." ASME. J. Heat Transfer. May 2009; 131(5): 052401. https://doi.org/10.1115/1.3084121
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