This study investigates heat dissipation at carbon nanotube (CNT) junctions supported on silicon dioxide substrate using molecular dynamics simulations. The temperature rise in a CNT (∼top CNT) not making direct contact with the oxide substrate but only supported by other CNTs (∼bottom CNT) is observed to be hundreds of degree higher compared with the CNTs well-contacted with the substrate at similar power densities. The analysis of spectral temperature decay of CNT-oxide system shows very fast intratube energy transfer in a CNT from high-frequency band to intermediate-frequency bands. The low frequency phonon band (0–5 THz) of top CNT shows two-stage energy relaxation which results from the efficient coupling of low frequency phonons in the CNT-oxide system and the blocking of direct transport of high- and intermediate-frequency phonons of top CNT to the oxide substrate by bottom CNT.
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Research-Article
Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate
Liang Chen,
Liang Chen
G.W. Woodruff School of Mechanical Engineering,
e-mail: lchen64@gatech.edu
Georgia Institute of Technology
,Atlanta, GA 30332
e-mail: lchen64@gatech.edu
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Satish Kumar
Satish Kumar
G.W. Woodruff School of Mechanical Engineering,
e-mail: satish.kumar@me.gatech.edu
Georgia Institute of Technology
,Atlanta, GA 30332
e-mail: satish.kumar@me.gatech.edu
Search for other works by this author on:
Liang Chen
G.W. Woodruff School of Mechanical Engineering,
e-mail: lchen64@gatech.edu
Georgia Institute of Technology
,Atlanta, GA 30332
e-mail: lchen64@gatech.edu
Satish Kumar
G.W. Woodruff School of Mechanical Engineering,
e-mail: satish.kumar@me.gatech.edu
Georgia Institute of Technology
,Atlanta, GA 30332
e-mail: satish.kumar@me.gatech.edu
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received November 30, 2012; final manuscript received September 2, 2013; published online March 6, 2014. Assoc. Editor: Patrick E. Phelan.
J. Heat Transfer. May 2014, 136(5): 052401 (7 pages)
Published Online: March 6, 2014
Article history
Received:
November 30, 2012
Revision Received:
September 2, 2013
Citation
Chen, L., and Kumar, S. (March 6, 2014). "Heat Dissipation Mechanism at Carbon Nanotube Junctions on Silicon Oxide Substrate." ASME. J. Heat Transfer. May 2014; 136(5): 052401. https://doi.org/10.1115/1.4025436
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