At the microscale length and smaller, solid–solid interfaces pose a significant contribution to resistance, resulting in a build-up of energy carriers, in turn leading to extreme temperature gradients within a single electronic component. These localized temperature gradients, or “hot spots,” are known to promote degradation, thus reducing device longevity and performance. To mitigate thermal management issues, it is crucial to both measure and understand conductance at interfaces in technologically relevant thin film systems. Recent trends in photonic devices have been pushing the consumption of indium in the U.S. to grow exponentially each year. Thus, we report on the temperature-dependent thermal boundary conductances at a series of metal/In-based III–V semiconductor interfaces. These measurements were made using time-domain thermoreflectance (TDTR) from 80 to 350 K. The high-temperature thermal boundary conductance results indicate, for these interfaces, that interfacial transport is dominated by elastic transmission, despite varying levels of acoustic mismatch. There is a strong direct correlation between the interfacial bond strength, approximated by the picosecond acoustics, and the thermal boundary conductance values. Both the interfacial bond strength and the overlap in the phonon density of states (PDOS) play significant roles in the magnitude of the thermal boundary conductance values. Measurements are compared against two separate predictive models, one for a perfect interface and one which accounts for disorder, such as interfacial mixing and finite grain sizes.
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March 2017
Research-Article
Temperature-Dependent Thermal Boundary Conductance at Metal/Indium-Based III–V Semiconductor Interfaces
LeighAnn S. Larkin,
LeighAnn S. Larkin
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
e-mail: LSL9HD@virginia.edu
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
e-mail: LSL9HD@virginia.edu
Search for other works by this author on:
MacKenzie R. Redding,
MacKenzie R. Redding
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Search for other works by this author on:
Nam Q. Le,
Nam Q. Le
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
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Pamela M. Norris
Pamela M. Norris
Fellow ASME
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Search for other works by this author on:
LeighAnn S. Larkin
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
e-mail: LSL9HD@virginia.edu
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
e-mail: LSL9HD@virginia.edu
MacKenzie R. Redding
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Nam Q. Le
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Pamela M. Norris
Fellow ASME
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Department of Mechanical and
Aerospace Engineering,
University of Virginia,
Charlottesville, VA 22904-4746
Contributed by the Heat Transfer Division of ASME for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received June 9, 2016; final manuscript received October 5, 2016; published online November 22, 2016. Assoc. Editor: Alan McGaughey.
J. Heat Transfer. Mar 2017, 139(3): 031301 (5 pages)
Published Online: November 22, 2016
Article history
Received:
June 9, 2016
Revised:
October 5, 2016
Citation
Larkin, L. S., Redding, M. R., Le, N. Q., and Norris, P. M. (November 22, 2016). "Temperature-Dependent Thermal Boundary Conductance at Metal/Indium-Based III–V Semiconductor Interfaces." ASME. J. Heat Transfer. March 2017; 139(3): 031301. https://doi.org/10.1115/1.4034938
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