1-20 of 101
Keywords: electronic cooling
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. April 2023, 145(4): 043001.
Paper No: HT-22-1461
Published Online: January 12, 2023
... 2023 artificial bee colony algorithm electronic cooling multi-objective optimization multiple PCMs melting and solidification Thermal management of electronics has emerged as a critical field of study, with continuous performance improvements (technological node) accompanied...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2020, 142(5): 052301.
Paper No: HT-19-1298
Published Online: March 17, 2020
... evaluated the thermal hydraulic performance for different foam configurations and the optimum value of a given PPI was found to be at an intermediate rather than the lowest foam thickness. Jet impingement metal foam heat transfer coefficient electronic cooling 24 05 2019 22 11 2019...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2019, 141(8): 082203.
Paper No: HT-19-1067
Published Online: July 3, 2019
... for a variety of applications including electronics cooling. In this work, advanced heat management devices are designed and numerically studied employing single and multijet impingement through porous-filled channels with inclined walls. The base of these porous-filled nonuniform heat exchanging channels...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. December 2018, 140(12): 122401.
Paper No: HT-17-1744
Published Online: August 28, 2018
... August 28, 2018. Assoc. Editor: Yuwen Zhang. 11 12 2017 10 07 2018 Electronic cooling Heat and mass transfer Heat exchangers Heat transfer enhancement Micro heat transfer Nanoscale heat transfer As the semiconductor industry develops rapidly, the heat production...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. November 2018, 140(11): 114502.
Paper No: HT-17-1444
Published Online: August 3, 2018
... for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received August 2, 2017; final manuscript received June 28, 2018; published online August 3, 2018. Assoc. Editor: Debjyoti Banerjee. 02 08 2017 28 06 2018 Electronic cooling Energy systems Melting Melting Freezing...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2018, 140(11): 111701.
Paper No: HT-17-1529
Published Online: July 23, 2018
... dynamics Electronic cooling Experimental techniques Heat and mass transfer Owing to their high efficiency, electrical machines are widely used in various industrial applications such as motors for automobiles, trains, electrical production in nuclear plants, and wind generators. However, because...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2018, 140(11): 112401.
Paper No: HT-17-1335
Published Online: July 23, 2018
... online July 23, 2018. Assoc. Editor: Thomas Beechem. 10 06 2017 28 03 2018 Electronic cooling Evaporation Heat transfer enhancement Micro heat transfer Two-phase flow Boiling Condensation Nanoscale heat transfer Heat transfer High-temperature, high heat flux thermal...
Journal Articles
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. August 2018, 140(8): 080901.
Paper No: HT-18-1274
Published Online: July 2, 2018
... role in double droplet train impingement cooling. This work was supported by the National Priority Research Program of the Qatar National Research Fund, Grant No.: NPRP 6-1304-2-525. Bubbles Computational fluid dynamics Electronic cooling Experimental techniques Jets Wakes Impingement Cooling...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. August 2018, 140(8): 082802.
Paper No: HT-17-1256
Published Online: June 29, 2018
... . Manuscript received May 8, 2017; final manuscript received November 13, 2017; published online June 29, 2018. Assoc. Editor: Zhixiong Guo. 08 05 2017 13 11 2017 Computational fluid dynamics Conduction Electronic cooling Energy systems Heat exchangers Heat transfer enhancement...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2018, 140(10): 102006.
Paper No: HT-18-1044
Published Online: June 8, 2018
... temperature given the junction temperature for one specific instance of power dissipation and base temperature and hence may find applicability in fast electrothermal solvers. Conduction Electronic cooling Thermophysical properties An integrated circuit's junction (or channel) temperature...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2018, 140(10): 102501.
Paper No: HT-16-1619
Published Online: June 7, 2018
... Barletta. 02 10 2016 26 04 2018 Electronic cooling Extended surfaces Natural convection Thermal systems Mixed convection Heat is produced as a by-product during the normal operation from the electronic equipment. Miniaturization of these devices introduces enhanced power...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2018, 140(9): 092403.
Paper No: HT-17-1218
Published Online: May 25, 2018
... for publication in the J OURNAL OF H EAT T RANSFER . Manuscript received April 19, 2017; final manuscript received April 21, 2018; published online May 25, 2018. Assoc. Editor: Thomas Beechem. 19 04 2017 21 04 2018 Aerospace Electronic cooling Extended surfaces Heat exchangers Heat...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. September 2018, 140(9): 094503.
Paper No: HT-17-1628
Published Online: May 22, 2018
... and fluid flow inside the enclosure. But in several real life applications, the flow geometry is complicated with embedded solid bodies or fins or partial baffles. The coupled surface radiation and natural convection in such complex enclosures have been reported by few authors [ 5 – 8 ]. Electronic...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2018, 140(7): 071302.
Paper No: HT-17-1227
Published Online: April 6, 2018
... OF H EAT T RANSFER . Manuscript received April 24, 2017; final manuscript received October 29, 2017; published online April 6, 2018. Assoc. Editor: Alan McGaughey. 24 04 2017 29 10 2017 Conduction Electronic cooling Thermal management is considered as a key factor...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. June 2018, 140(6): 061703.
Paper No: HT-17-1395
Published Online: March 9, 2018
... 2018 Computational fluid dynamics Electronic cooling Forced convection Heat transfer enhancement Micro heat transfer Nanoscale heat transfer A sessile droplet on a structured surface characterized by small periodic length scales compared to the capillary length may be stable...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2018, 140(5): 052403.
Paper No: HT-17-1310
Published Online: January 30, 2018
..., 2017; final manuscript received October 16, 2017; published online January 30, 2018. Assoc. Editor: Ali Khounsary. 30 05 2017 16 10 2017 Electronic cooling Heat exchangers Micro heat transfer Nanoscale heat transfer Flow networks are characterized by a plurality...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. May 2018, 140(5): 052501.
Paper No: HT-17-1177
Published Online: January 30, 2018
... 13, 2017; published online January 30, 2018. Assoc. Editor: Zhixiong Guo. 30 03 2017 13 09 2017 Electronic cooling Natural convection Thermophysical properties Mixed convection Natural convection plays an important role in the cooling of electrical and electronic...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. March 2018, 140(3): 032201.
Paper No: HT-17-1099
Published Online: October 10, 2017
..., and their geometrical compatibility with proposed PIC packages. Electronic cooling Forced convection Heat and mass transfer Heat transfer enhancement Jets Wakes Impingement Cooling 22 02 2017 10 07 2017 Contributed by the Heat Transfer Division of ASME for publication in the J OURNAL...